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Entries Tagged as 'Semiconductor'

Got (Expensive Solder) Balls?

May 20th, 2011 · No Comments

Every so often, when flipping through the Trade Journals, there is an ad or a column that will catch our eye. In the last few issues of the Semiconductor Trade Journals, EasySpheres has been running this Ad, “Got Balls”. Everytime I see it, I can’t help but think, “Yep, you’ve got balls, alright… charging so [...]

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Tags: Semiconductor · Solder Spheres

High-Temperature Dicing Tape on Release Liner

January 31st, 2011 · No Comments

CAPLINQ is pleased to announce PIT2S-RL, its newest polyimide tape introduction designed as a no-residue High Temperature Mounting Tape on PET Release Liner. LINQTAPE™ PIT2S-RL-Series Polyimide Tape is a high-temperature resistant polyimide tape on a 2mil PET Release Liner. It is designed primarily for high temperature temporary bonding applications and it removes cleanly without adhesive [...]

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Tags: Business Development · Linqtape · Semiconductor

Pb-free SAC405 Solder Sphere Pricing

October 8th, 2010 · No Comments

Over the past 4 years, CAPLINQ and Profound Materials have steady increased their solder sphere market share and displaced traditional solder ball market leaders Senju, Accurus (Henkel), and Cookson in a very simple way: by providing high-quality solder spheres at the market’s lowest prices. Globally, Profound Material supplies solder spheres to 9 of the top [...]

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Tags: Semiconductor · Solder Spheres

Tin/Lead Sn63Pb37 Solder Sphere Pricing

October 8th, 2010 · No Comments

Over the past 4 years, CAPLINQ and Profound Materials have steady increased their solder sphere market share and displaced traditional solder ball market leaders Senju, Accurus (Henkel), and Cookson in a very simple way: by providing high-quality solder spheres at the market’s lowest prices. Globally, Profound Material supplies solder spheres to 9 of the top [...]

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Tags: Semiconductor · Solder Spheres

Pb-free SAC305 Solder Sphere Pricing

October 8th, 2010 · No Comments

Over the past 4 years, CAPLINQ and Profound Materials have steady increased their solder sphere market share and displaced traditional solder ball market leaders Senju, Accurus (Henkel), and Cookson in a very simple way: by providing high-quality solder spheres at the market’s lowest prices. Globally, Profound Material supplies solder spheres to 9 of the top [...]

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Tags: Semiconductor · Solder Spheres

SAC305, SAC405 & Sn63Pb37 Solder Spheres Harmonization Codes

March 18th, 2010 · 1 Comment

As mentioned in an earlier post and part of CAPLINQ’s efforts to compete in the sales of SAC305, SAC405 and Sn63Pb37 solder spheres online, we are pleased to post the harmonization codes for these products. Customs Harmonization Code (HTS#) for SAC 305 and SAC405 Solder Spheres 8001.20.00.10: Unwrought tin: Tin alloys containing, by weight, 5 [...]

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Tags: Semiconductor · Solder Spheres

LINQSTAT: Volume Resistivity vs. Volume Conductivity vs. Surface Resistivity

December 9th, 2009 · No Comments

When customers look at the technical datasheet (TDS) for LINQSTAT Volume Conductive Film, they often are confused by the Electrical Properties. The 3M Velostat material lists only Volume Resistivity as less than 500 ohm-cm, yet the LINQSTAT material lists Volume Resistivity, Volume Conductivity and Surface Resistivity. The fact of the matter is that they are [...]

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Tags: Linqstat · Semiconductor

PIT2SD to Mount Wafers for Thru-Wafer Etching

September 18th, 2009 · No Comments

Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions that dislodge portions of the material from the exposed surface. Unlike with many of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically. [...]

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Tags: Industrial Tapes · Semiconductor

UL 94V Certification vs. UL 94 VTM Certification

August 14th, 2009 · No Comments

In an earlier blog concerning CAPLINQ’s UL Certification policy, it was outlined how CAPLINQ supports its customers with the UL certification of polyimide and other tapes. This time, the differences between UL94 V-0 and UL94 VTM-0 will be described. Certification Classification For tapes and other thin materials, the certification classification typically used is UL94 VTM-0. [...]

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Tags: Industrial Tapes · Semiconductor

Same Size Die Stacking | Wafer Back Side Coating (WBC) Options

June 16th, 2009 · No Comments

Shin-Etsu SFX-513S, SFX-524A and SFX-526A are Wafer Backside Coating (WBC) Options for same-size die stacking.

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Tags: Semiconductor · Silicones

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