As mentioned in an earlier post and part of CAPLINQ’s efforts to compete in the sales of SAC305, SAC405 and Sn63Pb37 solder spheres online, we are pleased to post the harmonization codes for these products. Customs Harmonization Code (HTS#) for SAC 305 and SAC405 Solder Spheres 8001.20.00.10: Unwrought tin: Tin alloys containing, by weight, 5 [...]

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When customers look at the technical datasheet (TDS) for LINQSTAT Volume Conductive Film, they often are confused by the Electrical Properties. The 3M Velostat material lists only Volume Resistivity as less than 500 ohm-cm, yet the LINQSTAT material lists Volume Resistivity, Volume Conductivity and Surface Resistivity. The fact of the matter is that they are [...]

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Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions that dislodge portions of the material from the exposed surface. Unlike with many of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically. [...]

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In an earlier blog concerning CAPLINQ’s UL Certification policy, it was outlined how CAPLINQ supports its customers with the UL certification of polyimide and other tapes. This time, the differences between UL94 V-0 and UL94 VTM-0 will be described. Certification Classification For tapes and other thin materials, the certification classification typically used is UL94 VTM-0. [...]

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Shin-Etsu SFX-513S, SFX-524A and SFX-526A are Wafer Backside Coating (WBC) Options for same-size die stacking.

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When using Epoxy Mold Compound (EMC), what is the proper cleaning procedure to follow to ensure a proper mold cleaning, while avoiding wasting valuable production uptime?  How many shots of melamine and/or mold conditioner are needed for a proper cleaning?  These are the standard questions that we get asked regularly by new process engineers and [...]

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Same size die stacking is different from other die stacking in that the bondline thickness must be a minimum of 60µm – 80µm high to ensure enough wirebond-loop height. In short, there are four proven ways to achieve this: Dummy-Die silicon interposer (a space-consuming, expensive and redundant method not discussed here as it is a [...]

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CAPLINQ does work with an independent testing facility who can carry out this the UL Certification, but then CAPLINQ normally requests either a commitment for a certain order quantity (ie. 100 rolls), or that the customer pay for the testing.

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CAPLINQ’s non-adhesive polyimide (Kapton) film – it’s PITN-Series – has been successfully tested as a release film in a welding press that fuses PTFE-coated composite conveyor belting.

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Shin-Etsu KJR silicones are used extensively in the manufacture of ICs, transistors, diodes and other semiconductor devices. KJR-4013E is a flexible, moisture-cure silicone most often used as junction-coating resins in the manufacture of diodes. KJR-651E, KJR-655E and KJR-657E are rigid thermoset polyimide-silicones used as junction coating resins in the manufacture of higher power diodes and [...]

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