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	<title>CAPLINQ Blog</title>
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	<link>http://www.caplinq.com/blog</link>
	<description>Technical support of epoxy, solder spheres, LED, polyimide and tapioca starch</description>
	<lastBuildDate>Fri, 17 May 2013 08:29:23 +0000</lastBuildDate>
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		<title>LINQSTAT: Volume Resistivity vs. Volume Conductivity vs. Surface Resistivity</title>
		<link>http://www.caplinq.com/blog/linqstat-volume-resistivity-vs-volume-conductivity-vs-surface-resistivity_267/</link>
		<comments>http://www.caplinq.com/blog/linqstat-volume-resistivity-vs-volume-conductivity-vs-surface-resistivity_267/#comments</comments>
		<pubDate>Thu, 16 May 2013 19:36:45 +0000</pubDate>
		<dc:creator>LINQblog</dc:creator>
				<category><![CDATA[Anti-Static (ESD) Products]]></category>
		<category><![CDATA[Bulk Conductivity]]></category>
		<category><![CDATA[Electrical Properties]]></category>
		<category><![CDATA[Linqstat]]></category>
		<category><![CDATA[Sheet Resistance]]></category>
		<category><![CDATA[Surface Resistance]]></category>
		<category><![CDATA[Surface Resistivity]]></category>
		<category><![CDATA[Velostat]]></category>
		<category><![CDATA[Volume Conductivity]]></category>
		<category><![CDATA[Volume resistivity]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=267</guid>
		<description><![CDATA[When customers look at the technical datasheet (TDS) for LINQSTAT Volume Conductive Film, they often are confused by the Electrical Properties. The 3M Velostat material lists only Volume Resistivity as less than 500 ohm-cm, yet the LINQSTAT material lists Volume Resistivity, Volume Conductivity and Surface Resistivity. The fact of the matter is that they are [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>UL-approved Class B Epoxy Mold Compounds for Coil and Bobbin Encapsulation</title>
		<link>http://www.caplinq.com/blog/ul-approved-class-b-epoxy-mold-compounds-for-coil-and-bobbin-encapsulation_712/</link>
		<comments>http://www.caplinq.com/blog/ul-approved-class-b-epoxy-mold-compounds-for-coil-and-bobbin-encapsulation_712/#comments</comments>
		<pubDate>Thu, 07 Mar 2013 11:26:18 +0000</pubDate>
		<dc:creator>LINQblog</dc:creator>
				<category><![CDATA[Epoxy Coating Powders]]></category>
		<category><![CDATA[Epoxy Compounds]]></category>
		<category><![CDATA[Epoxy Mold Compound]]></category>
		<category><![CDATA[Injection Mold Epoxy]]></category>
		<category><![CDATA[SolEpoxy]]></category>
		<category><![CDATA[UL]]></category>
		<category><![CDATA[UL certification]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=712</guid>
		<description><![CDATA[UL gives all of SolEpoxy&#8217;s Epoxy Molding Powder Compounds a generic 130°C (Class B) operating temperature rating without testing Recently, we were asked if we could supply a UL-approved class B Epoxy Mold Compound system as bobbin and encapsulation material. Class B means that the material can be run continuously at temperatures of 130°C. The [...]]]></description>
		<wfw:commentRss>http://www.caplinq.com/blog/ul-approved-class-b-epoxy-mold-compounds-for-coil-and-bobbin-encapsulation_712/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Risk to Shelf-Life of Epoxy during Shipping</title>
		<link>http://www.caplinq.com/blog/risk-to-shelf-life-of-epoxy-during-shipping_703/</link>
		<comments>http://www.caplinq.com/blog/risk-to-shelf-life-of-epoxy-during-shipping_703/#comments</comments>
		<pubDate>Fri, 18 Jan 2013 11:43:11 +0000</pubDate>
		<dc:creator>LINQblog</dc:creator>
				<category><![CDATA[Epoxy Coating Powders]]></category>
		<category><![CDATA[Epoxy Compounds]]></category>
		<category><![CDATA[Epoxy Mold Compound]]></category>
		<category><![CDATA[Injection Mold Epoxy]]></category>
		<category><![CDATA[incomplete fill]]></category>
		<category><![CDATA[risks]]></category>
		<category><![CDATA[short flow]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=703</guid>
		<description><![CDATA[The single biggest risk associated with storage at higher than the recommended storage conditions is a reducing of flow rate. Epoxy molding compounds when blended already have the resin/hardener combination into one blend &#8211; and this is what we call a &#8220;B-stage&#8221; material. B-stage refers to a stage between the unmixed (A-stage) and the cured [...]]]></description>
		<wfw:commentRss>http://www.caplinq.com/blog/risk-to-shelf-life-of-epoxy-during-shipping_703/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Environmental Philosophy + Sustainability = Green Chemistry!</title>
		<link>http://www.caplinq.com/blog/environmental-philosophy-sustainability-green-chemistry_643/</link>
		<comments>http://www.caplinq.com/blog/environmental-philosophy-sustainability-green-chemistry_643/#comments</comments>
		<pubDate>Thu, 06 Sep 2012 15:42:53 +0000</pubDate>
		<dc:creator>LINQblog</dc:creator>
				<category><![CDATA[Epoxy Coating Powders]]></category>
		<category><![CDATA[Epoxy Mold Compound]]></category>
		<category><![CDATA[epoxy coating powder]]></category>
		<category><![CDATA[Green]]></category>
		<category><![CDATA[halogen-free]]></category>
		<category><![CDATA[REACH]]></category>
		<category><![CDATA[RoHs]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=643</guid>
		<description><![CDATA[At SolEpoxy, we care about the environment and the role that we can play in preserving it for our children and generations to come. This means that we think about the applications where our products are used and make a conscious choice to use develop formulations that can be used for years to come with [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Formulating Coating Powders for the Passive Electronic Component Industry</title>
		<link>http://www.caplinq.com/blog/formulating-coating-powders-for-the-passive-electronic-component-industry_620/</link>
		<comments>http://www.caplinq.com/blog/formulating-coating-powders-for-the-passive-electronic-component-industry_620/#comments</comments>
		<pubDate>Tue, 04 Sep 2012 14:36:16 +0000</pubDate>
		<dc:creator>LINQblog</dc:creator>
				<category><![CDATA[Epoxy Coating Powders]]></category>
		<category><![CDATA[epoxy coating powder]]></category>
		<category><![CDATA[Jim Glover]]></category>
		<category><![CDATA[SolEpoxy]]></category>
		<category><![CDATA[technical paper]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=620</guid>
		<description><![CDATA[Pulled from the Dexter Electronic Materials (now SolEpoxy) archives, this technical paper was written in April 1996 by Jim Glover, Project Leader Abstract Many capacitors and resistors require an insulating coating after manufacture to protect against physical, chemical and electrical stresses. These components are often mounted on circuit boards and may be hermetically sealed in [...]]]></description>
		<wfw:commentRss>http://www.caplinq.com/blog/formulating-coating-powders-for-the-passive-electronic-component-industry_620/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Application of Powder Coatings for Electronic Component Protection</title>
		<link>http://www.caplinq.com/blog/application-of-powder-coatings-for-electronic-component-protection_609/</link>
		<comments>http://www.caplinq.com/blog/application-of-powder-coatings-for-electronic-component-protection_609/#comments</comments>
		<pubDate>Tue, 04 Sep 2012 13:22:46 +0000</pubDate>
		<dc:creator>LINQblog</dc:creator>
				<category><![CDATA[Epoxy Coating Powders]]></category>
		<category><![CDATA[component protection]]></category>
		<category><![CDATA[epoxy coating powder]]></category>
		<category><![CDATA[fluidized bed]]></category>
		<category><![CDATA[pantleg]]></category>
		<category><![CDATA[SolEpoxy]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=609</guid>
		<description><![CDATA[Pulled from the Dexter Electronic Materials (now SolEpoxy) archives, this technical paper was written in April 1995 by Joseph Kubic, Senior Laboratory Technician Understanding the correlation between components, coating powder and coating equipment has become increasingly important in recent years. With pressure to improve productivity, increase yields and minimize downtime, it will be essential to [...]]]></description>
		<wfw:commentRss>http://www.caplinq.com/blog/application-of-powder-coatings-for-electronic-component-protection_609/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>Pelnox falls short on delivery of Pelnox PCE-282 to Europe</title>
		<link>http://www.caplinq.com/blog/pelnox-falls-short-on-delivery-of-pelnox-pce-282-to-europe_591/</link>
		<comments>http://www.caplinq.com/blog/pelnox-falls-short-on-delivery-of-pelnox-pce-282-to-europe_591/#comments</comments>
		<pubDate>Thu, 26 Jul 2012 10:27:12 +0000</pubDate>
		<dc:creator>ivo.verzijlbergen</dc:creator>
				<category><![CDATA[Epoxy Coating Powders]]></category>
		<category><![CDATA[Epoxy Mold Compound]]></category>
		<category><![CDATA[epoxy coating powder]]></category>
		<category><![CDATA[PCE-282]]></category>
		<category><![CDATA[Pelnox]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=591</guid>
		<description><![CDATA[No purchasing manager wants to imagine a scenario wherein their production lines are down due to a shortage of raw material. Recently, CAPLINQ is getting many requests from new customers as Pelnox PCE-282 is barely available within the European market. Fortunately, CAPLINQ offer and have stock of DK17-0925 and DK18-05 Blue which are competitive alternatives [...]]]></description>
		<wfw:commentRss>http://www.caplinq.com/blog/pelnox-falls-short-on-delivery-of-pelnox-pce-282-to-europe_591/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Varistor and Capacitor Processing Parameters with Epoxy Coating Powder</title>
		<link>http://www.caplinq.com/blog/varistor-and-capacitor-processing-parameters-with-epoxy-coating-powder_575/</link>
		<comments>http://www.caplinq.com/blog/varistor-and-capacitor-processing-parameters-with-epoxy-coating-powder_575/#comments</comments>
		<pubDate>Tue, 17 Jul 2012 10:13:16 +0000</pubDate>
		<dc:creator>LINQblog</dc:creator>
				<category><![CDATA[Epoxy Coating Powders]]></category>
		<category><![CDATA[bubbles]]></category>
		<category><![CDATA[capacitor]]></category>
		<category><![CDATA[epoxy coating powder]]></category>
		<category><![CDATA[functional coating powders]]></category>
		<category><![CDATA[troubleshooting]]></category>
		<category><![CDATA[varistor]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=575</guid>
		<description><![CDATA[As users of Epoxy Coating Powders may understand, there are really two processes involved when applying the Epoxy Coating Powders to passive components such as varistors and capacitors: the application process and the curing process. The goal of this article is to highlight the two distinct processes and to help the user understand how best [...]]]></description>
		<wfw:commentRss>http://www.caplinq.com/blog/varistor-and-capacitor-processing-parameters-with-epoxy-coating-powder_575/feed/</wfw:commentRss>
		<slash:comments>1</slash:comments>
		</item>
		<item>
		<title>Temperature resistance of silicones used for P-N junction-coating resins for diode assembly</title>
		<link>http://www.caplinq.com/blog/temperature-resistance-of-silicones-used-for-p-n-junction-coating-resins-for-diode-assembly_564/</link>
		<comments>http://www.caplinq.com/blog/temperature-resistance-of-silicones-used-for-p-n-junction-coating-resins-for-diode-assembly_564/#comments</comments>
		<pubDate>Mon, 14 May 2012 13:48:26 +0000</pubDate>
		<dc:creator>LINQblog</dc:creator>
				<category><![CDATA[LED]]></category>
		<category><![CDATA[Silicones]]></category>
		<category><![CDATA[junction coating]]></category>
		<category><![CDATA[KJR-4013E]]></category>
		<category><![CDATA[p-n junction]]></category>
		<category><![CDATA[Shin-Etsu]]></category>
		<category><![CDATA[TGA]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=564</guid>
		<description><![CDATA[Recently, a customer using Shin-Etsu KJR-4013, the industry-standard for p-n junction-coating resins, asked if they could use the KJR-4013E at temperatures of 500C for 10 minutes. This because this was the solder profile used for solder reflow. KJR-4013E is a flexible, moisture-cure silicone most often used as p-n junction-coating resins in the manufacture of diodes. [...]]]></description>
		<wfw:commentRss>http://www.caplinq.com/blog/temperature-resistance-of-silicones-used-for-p-n-junction-coating-resins-for-diode-assembly_564/feed/</wfw:commentRss>
		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Using Solder Spheres in Semi-automatic BGA ball placement machines</title>
		<link>http://www.caplinq.com/blog/using-solder-spheres-in-semi-automatic-bga-ball-placement-machines_557/</link>
		<comments>http://www.caplinq.com/blog/using-solder-spheres-in-semi-automatic-bga-ball-placement-machines_557/#comments</comments>
		<pubDate>Thu, 03 May 2012 13:27:28 +0000</pubDate>
		<dc:creator>LINQblog</dc:creator>
				<category><![CDATA[Business Development]]></category>
		<category><![CDATA[Solder Spheres]]></category>
		<category><![CDATA[BGA Ball Placement]]></category>
		<category><![CDATA[SAC305]]></category>
		<category><![CDATA[SAC387]]></category>
		<category><![CDATA[SAC405]]></category>
		<category><![CDATA[solder balls]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=557</guid>
		<description><![CDATA[Recently, a customer using solder spheres in a semi-automatic BGA solder ball placement machine asked if it was ok to leave these solder spheres for several days in the tray, or they should be removed and placed back in the jar after the production cycle was complete. The reason the customer asked this question was [...]]]></description>
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		<slash:comments>0</slash:comments>
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