Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions that dislodge portions of the material from the exposed surface. Unlike with many of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically.

PIT2SD, a 2-mil double-sided polyimide tape is often used to mount wafers on a carrier for through wafer etching and it works very well.

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