Process to remove cured KJR silicone from IC’s (Decapping)

Shin-Etsu KJR sil­i­cones are used exten­sive­ly in the man­u­fac­ture of ICs, tran­sis­tors, diodes and oth­er semi­con­duc­tor devices.

KJR-4013E is a flex­i­ble, mois­ture-cure sil­i­cone most often used as junc­tion-coat­ing resins in the man­u­fac­ture of diodes. KJR-651E, KJR-655E and KJR-657E are rigid ther­moset poly­imide-sil­i­cones used as junc­tion coat­ing resins in the man­u­fac­ture of high­er pow­er diodes and thyris­tors. Both are used due to their excel­lent adhe­sion to epoxy mold­ing com­pounds (EMC), high humid­i­ty resis­tance, and excel­lent vol­ume resis­tiv­i­ty and dielec­tric break­down properties.

To be able to con­duct fail­ure analy­sis, cus­tomers have asked if there is a process to remove the cured sil­i­cone / poly­imide-sil­i­cone from the diodes and/or thyris­tors (decap).

One rec­om­men­da­tion is to use sul­phuric acid (H2SO4) which can nor­mal­ly clear­ly strip organ­ic com­pounds. Nitric acid (HNO3) is anoth­er option. If the dis­solv­ing rate is slow, adding heat to the process helps very much. Of course, for either of these process­es, a fume hood is nec­es­sary all the time.

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