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	<title>Comments on: Same-Size Die-Stacking Options &#124; DDAF, WBC, Spacers</title>
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	<description>Technical support of solder spheres, LED, polyimide and tapioca starch</description>
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		<title>By: Same Size Die Stacking &#124; Wafer Back Side Coating (WBC) Options &#124; Shin-Etsu SFX-513S, SFX-524A and SFX-526A</title>
		<link>http://www.caplinq.com/blog/same-size-die-stacking-options-ddaf-wbc-spacers_133/comment-page-1/#comment-6063</link>
		<dc:creator>Same Size Die Stacking &#124; Wafer Back Side Coating (WBC) Options &#124; Shin-Etsu SFX-513S, SFX-524A and SFX-526A</dc:creator>
		<pubDate>Tue, 16 Jun 2009 10:59:55 +0000</pubDate>
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		<description>[...] the last post about Same Size Die Stacking Options, we discussed the various ways to do same size die stacking of die, a typical configuration for [...]</description>
		<content:encoded><![CDATA[<p>[...] the last post about Same Size Die Stacking Options, we discussed the various ways to do same size die stacking of die, a typical configuration for [...]</p>
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