What is the heat capacity of epoxy mold compounds used in semiconductor assembly? Though this information varies based on many variables, the most critical parameters are the filler loading and the loading percentage. Since most epoxy mold compounds use silica as filler and are on average between 80-85% loaded, the approximate heat capacity for these [...]

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Mold conditioner is a “more-highly” wax-filled mold compound that conditions the mold for transfer molding epoxy mold compound. Prior to conditioning the mold, it is a common industry practice to use Melamine / Cleaning pellets to clean the mold chase/die. The mold cleaning process typically leaves the mold surface very dry, and this is why [...]

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Customers often ask what is the maximum aspect ratio (Pellet Height or Length / Pellet Diameter) of epoxy molding compound (EMC).  While this varies from manufacturer to manufacturer, the reason for the maximum aspect ratio is to prevent pellets from cracking or damaging during transportation. For an 18mm Diameter Pellet the Maximum Aspect Ratio is: [...]

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