CAPLINQ Blog » emc

Heat Capacity of Epoxy Molding Compound

LINQblog — Mon, 02 Mar 2009 09:08:28 +0000

What is the heat capacity of epoxy mold compounds used in semiconductor assembly?

Though this information varies based on many variables, the most critical parameters are the filler loading and the loading percentage. Since most epoxy mold compounds use silica as filler and are on average between 80-85% loaded, the approximate heat capacity for these materials is 0.8J/gK.

For more information on epoxy mold compounds, or to request that CAPLINQ help you make the proper selection, please contact us or visit the CAPLINQ website today for more information.

The proper cleaning procedure after Epoxy Molding Compound When using Epoxy Mold Compound (EMC), what is the proper...
What percentage of Carnauba Wax Spray is used in Epoxy Mold Compound? As described in the article “What is the right application...
The correct mold cleaning ratio for epoxy Mold Compound (EMC) Mold conditioner is a “more-highly” wax-filled mold compound that conditions...

The correct mold cleaning ratio for epoxy Mold Compound (EMC)

LINQblog — Tue, 10 Feb 2009 16:05:54 +0000

Mold conditioner is a “more-highly” wax-filled mold compound that conditions the mold for transfer molding epoxy mold compound. Prior to conditioning the mold, it is a common industry practice to use Melamine / Cleaning pellets to clean the mold chase/die. The mold cleaning process typically leaves the mold surface very dry, and this is why mold conditioning is performed.

There are two ways to control the mold cleaning frequency.
1. You may do it on a “time” basis, ie. once per day or every 24hr.
2. Another way is on a “No. of mold shots” basis, e.g. after 400, 500 or 600 mold shots.

Both of these figures are typical industry standards, but your particular situation may depend on the mold design and mold compound properties. Some mold compound may dirty the mold very easily after a few hundred mold shots or less per day. In this case, it is recommended to implement mold cleaning frequency base on “No. of mold shots”.

When ordering mold conditioner with epoxy mold compound – a useful ration is 50:1. You should order at least 1kg of mold conditioner for every 50kgs of mold compound. You may be more, you may need less, and this can be tested and validated. This is a good starting point.

Visit the CAPLINQ website today to find out more, or contact us for more information.

The proper cleaning procedure after Epoxy Molding Compound When using Epoxy Mold Compound (EMC), what is the proper...
What percentage of Carnauba Wax Spray is used in Epoxy Mold Compound? As described in the article “What is the right application...
Heat Capacity of Epoxy Molding Compound What is the heat capacity of epoxy mold compounds used...

EMC Pellet Aspect Ratio

LINQblog — Wed, 14 Jan 2009 01:52:16 +0000

Customers often ask what is the maximum aspect ratio (Pellet Height or Length / Pellet Diameter) of epoxy molding compound (EMC). While this varies from manufacturer to manufacturer, the reason for the maximum aspect ratio is to prevent pellets from cracking or damaging during transportation.

For an 18mm Diameter Pellet the Maximum Aspect Ratio is: 1.63

This means that the Maximum Pellet Height for an 18mm diameter pellet is 29.4mm. Of course, shorter pellets are ok, but 29.4mm is the maximum height.

The correct mold cleaning ratio for epoxy Mold Compound (EMC) Mold conditioner is a “more-highly” wax-filled mold compound that conditions...
Heat Capacity of Epoxy Molding Compound What is the heat capacity of epoxy mold compounds used...