Below is the recommended cleaning procedure:

Step 1: Do 10 shots of Melamine at 175°C for 300s
Step 2: Do 3-5 shots of Mold conditioner at 175°C for 180s
Step 3: Run 2 shots of dummy shots at 175°C for 90s @ 2 shots
Step 4: Resume production as usual

For more information on epoxy molding compound or other semiconductor consumables, visit us or contact us for more details.

Though this information varies based on many variables, the most critical parameters are the filler loading and the loading percentage. Since most epoxy mold compounds use silica as filler and are on average between 80-85% loaded, the approximate heat capacity for these materials is 0.8J/gK.

For more information on epoxy mold compounds, or to request that CAPLINQ help you make the proper selection, please contact us or visit the CAPLINQ website today for more information.

What is the compostion of Epoxy Molding Compounds?

There is only a very small percentage of carnauba wax used in the manufacture of epoxy mold compounds used for integrated circuit (IC) and passive device manufacturer. By far, the largest composition of epoxy mold compound by weight is the filler, which accounts for somewhere between 60-90% of the composition.

After this, the epoxy resin and the hardner complete the bulk of the composition accounting for another 15-40%. Finally, catalysts, pigments, flame retardants, low-stress absorbers, adhesion promoters, catalysts, coupling agents and release agents combined making up less than 10% of the total composition. Of this, carnauba wax consists of less than 0.5% of the raw ingredients by weight and its primary function is mold release. To recap, the raw materials, listed in decreasing order of weight % used are:

1. Filler
2. Epoxy Resin
3. Hardner
4. Flame retardants
5. Stress Absorbers
6. Adhesion Promoters
7. Catalyst
8. Pigment
9. Coupling Agent
10. Carnauba Wax used for Mold release

Each of these raw materials has specific functions within the whole of the epoxy molding compound.

Function of Carnauba Wax Mold Release

Carnauba Wax within the Epoxy Mold Compound has two main functions:

• Acting as a flow promoter within the compound itself
• Providing a mold release for the epoxy mold compound in the mold cavity and chase

In an ideal situation, no additional mold release would be required, but as explained in What is the right application for Carnauba Wax Aerosol Spray? there are simply two many non-ideal situations which necessitate additional Carnauba Wax Aerosol Spray. To understand a little more, let’s take a look at how the carnauba wax functions as a mold release agent.

How Carnauba Wax Works as a Mold Release Agent

As can be seen in the first schematic (click on it for larger view), before molding, the carnauba wax , represented by the shark-tooth shaped lines are randomly distributed within the epoxy mold compound matrix.

In the second schematic (again, click on it for larger view), you can see that the carnauba wax when heated escapes to the outside of the matrix, allowing the epoxy mold compound to release from the mold chase inside.

CAPLINQ offers a variety of Carnauba Wax Mold Release Aerosol Sprays. Visit CAPLINQ.com today or ask us how we can help you select the right tape for your application.