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CAPLINQ Polyimide Tape used to sputter metals on wafers

December 8th, 2009 · No Comments

CAPLINQ LINQTAPE Polyimide Film can be used to sputter metals, including precious metals like Gold (Au) and Titanium (Ti). This may be done for various reasons including: Sputtering metals on silicon wafers Study the inter-metallic layers formed during metal deposition Study the metal-polyimide interface Carry out X-ray photoelectron spectroscopy The first test is to determine [...]

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Tags: Linqtape · Polyimide

Converting from Gold to Copper Wire

March 16th, 2009 · No Comments

In many cases, customers move from a 25um Au wire to a 20um Au wire to save money. In the case of Au, it’s simple arithmetic, 20um is 20% cheaper than 25um. However, in the conversion to Cu wire, the savings are already so dramatic to go from Au wire to Cu wire, and the [...]

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Tags: Semiconductor

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