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CAPLINQ Polyimide Tape used to sputter metals on wafers

December 8th, 2009 · No Comments

CAPLINQ LINQTAPE Polyimide Film can be used to sputter metals, including precious metals like Gold (Au) and Titanium (Ti). This may be done for various reasons including: Sputtering metals on silicon wafers Study the inter-metallic layers formed during metal deposition Study the metal-polyimide interface Carry out X-ray photoelectron spectroscopy The first test is to determine [...]

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Tags: Linqtape · Polyimide

PIT2SD to Mount Wafers for Thru-Wafer Etching

September 18th, 2009 · No Comments

Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions that dislodge portions of the material from the exposed surface. Unlike with many of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically. [...]

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Tags: Industrial Tapes · Semiconductor

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