CAPLINQ Blog » PIT2SD http://www.caplinq.com/blog Technical support of solder spheres, LED, polyimide and tapioca starch Fri, 20 Aug 2010 14:44:41 +0000 en hourly 1 http://wordpress.org/?v=3.0.1 CAPLINQ Polyimide Tape used to sputter metals on wafers http://www.caplinq.com/blog/caplinq-polyimide-tape-used-to-sputter-metals-on-wafers_260/ http://www.caplinq.com/blog/caplinq-polyimide-tape-used-to-sputter-metals-on-wafers_260/#comments Tue, 08 Dec 2009 11:23:08 +0000 LINQblog http://www.caplinq.com/blog/?p=260 CAPLINQ LINQTAPE Polyimide Film can be used to sputter metals, including precious metals like Gold (Au) and Titanium (Ti). This may be done for various reasons including:

  • Sputtering metals on silicon wafers
  • Study the inter-metallic layers formed during metal deposition
  • Study the metal-polyimide interface
  • Carry out X-ray photoelectron spectroscopy

TapeSputter
The first test is to determine the thermal robustness of the CAPLINQ LINQTAPE PIT1SD and PIT2SD (double-sided, polyimide tape with silicone adhesive; 1mil and 2mil thick backing respectively). For the purpose of wafer metal deposition, Dr. Markus Lützelschwab, an R&D Engineer in the Optics & Packaging department of CSEM (Centre Suisse d’Electronic et de Microtechnique SA) carried out this test in Switzerland. He did some preliminary tests by sticking the PIT1SD and PIT2SD onto a glass container and heating the assembly using a hot-air solder tool. Using this test, he demonstrated that it showed the same thermal robustness as [single-sided] Kapton tape.

After this step, Dr. Lützelschwab sent the wafer with the LINQTAPE polyimide tape for a sputtering process. The LINQTAPE withstood easily the externally conducted sputtering process of Titanium and Gold. Attached is the picture of one corner of the LINQTAPE polyimde tape after sputtering.

For more information about polyimide tapes or any other of our products, visit us or contact us for more details.

]]> http://www.caplinq.com/blog/caplinq-polyimide-tape-used-to-sputter-metals-on-wafers_260/feed/ 0 PIT2SD to Mount Wafers for Thru-Wafer Etching http://www.caplinq.com/blog/pit2sd-to-mount-wafers-for-thru-wafer-etching_233/ http://www.caplinq.com/blog/pit2sd-to-mount-wafers-for-thru-wafer-etching_233/#comments Fri, 18 Sep 2009 11:28:06 +0000 LINQblog http://www.caplinq.com/blog/?p=233 Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions that dislodge portions of the material from the exposed surface. Unlike with many of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically.thru-wafer-etching

PIT2SD, a 2-mil double-sided polyimide tape is often used to mount wafers on a carrier for through wafer etching and it works very well.

For more information about polyimide tapes or any other of our products, visit us or contact us for more details.

]]> http://www.caplinq.com/blog/pit2sd-to-mount-wafers-for-thru-wafer-etching_233/feed/ 0