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	<title>CAPLINQ Blog&#187; PIT2SD</title>
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	<description>Technical support of solder spheres, LED, polyimide and tapioca starch</description>
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		<title>CAPLINQ Polyimide Tape used to sputter metals on wafers</title>
		<link>http://www.caplinq.com/blog/caplinq-polyimide-tape-used-to-sputter-metals-on-wafers_260/</link>
		<comments>http://www.caplinq.com/blog/caplinq-polyimide-tape-used-to-sputter-metals-on-wafers_260/#comments</comments>
		<pubDate>Tue, 08 Dec 2009 11:23:08 +0000</pubDate>
		<dc:creator>LINQblog</dc:creator>
				<category><![CDATA[Linqtape]]></category>
		<category><![CDATA[Polyimide]]></category>
		<category><![CDATA[CSEM]]></category>
		<category><![CDATA[deposition]]></category>
		<category><![CDATA[gold]]></category>
		<category><![CDATA[Lützelschwab]]></category>
		<category><![CDATA[photoelectron spectroscopy]]></category>
		<category><![CDATA[PIT1SD]]></category>
		<category><![CDATA[PIT2SD]]></category>
		<category><![CDATA[Silicone]]></category>
		<category><![CDATA[Titanium]]></category>
		<category><![CDATA[x-ray]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=260</guid>
		<description><![CDATA[CAPLINQ LINQTAPE Polyimide Film can be used to sputter metals, including precious metals like Gold (Au) and Titanium (Ti). This may be done for various reasons including: Sputtering metals on silicon wafers Study the inter-metallic layers formed during metal deposition Study the metal-polyimide interface Carry out X-ray photoelectron spectroscopy The first test is to determine [...]<h3>Related Posts</h3>
<ol>
		<li><a href="http://www.caplinq.com/blog/how-thick-is-polyimide-tape_32/" rel="bookmark">How thick is Polyimide Tape?</a><!-- (10.3)--></li>
		<li><a href="http://www.caplinq.com/blog/how-is-polyimide-film-made_7/" rel="bookmark">How is Polyimide Pressure Sensitive Tape Made?</a><!-- (8.7)--></li>
		<li><a href="http://www.caplinq.com/blog/pit0-5s-0-5mil-polyimide-film-with-silicone-adhesive_277/" rel="bookmark">PIT0.5S: 0.5mil Polyimide Film with Silicone Adhesive</a><!-- (8.6)--></li>
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		<title>PIT2SD to Mount Wafers for Thru-Wafer Etching</title>
		<link>http://www.caplinq.com/blog/pit2sd-to-mount-wafers-for-thru-wafer-etching_233/</link>
		<comments>http://www.caplinq.com/blog/pit2sd-to-mount-wafers-for-thru-wafer-etching_233/#comments</comments>
		<pubDate>Fri, 18 Sep 2009 11:28:06 +0000</pubDate>
		<dc:creator>LINQblog</dc:creator>
				<category><![CDATA[Industrial Tapes]]></category>
		<category><![CDATA[Semiconductor]]></category>
		<category><![CDATA[double-sided]]></category>
		<category><![CDATA[etching]]></category>
		<category><![CDATA[PIT2SD]]></category>
		<category><![CDATA[Polyimide]]></category>
		<category><![CDATA[through wafer etching]]></category>

		<guid isPermaLink="false">http://www.caplinq.com/blog/?p=233</guid>
		<description><![CDATA[Dry etching refers to the removal of material, typically a masked pattern of semiconductor material, by exposing the material to a bombardment of ions that dislodge portions of the material from the exposed surface. Unlike with many of the wet chemical etchants used in wet etching, the dry etching process typically etches directionally or anisotropically. [...]<h3>Related Posts</h3>
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		<li><a href="http://www.caplinq.com/blog/tape-adhesive-types-silicone-vs-acrylic-vs-rubber_41/" rel="bookmark">Tape adhesive types: Silicone vs. Acrylic vs. Rubber</a><!-- (5.2)--></li>
		<li><a href="http://www.caplinq.com/blog/caplinq-polyimide-tape-used-to-sputter-metals-on-wafers_260/" rel="bookmark">CAPLINQ Polyimide Tape used to sputter metals on wafers</a><!-- (5.1)--></li>
		<li><a href="http://www.caplinq.com/blog/same-size-die-stacking-wafer-back-side-coating-wbc-options_145/" rel="bookmark">Same Size Die Stacking | Wafer Back Side Coating (WBC) Options</a><!-- (4.3)--></li>
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