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The proper cleaning procedure after Epoxy Molding Compound

June 10th, 2009 by LINQblog · 6 Comments

When using Epoxy Mold Compound (EMC), what is the proper cleaning procedure to follow to ensure a proper mold cleaning, while avoiding wasting valuable production uptime?  How many shots of melamine and/or mold conditioner are needed for a proper cleaning?  These are the standard questions that we get asked regularly by new process engineers and operators.

Below is the recommended cleaning procedure:

Step 1: Do 10 shots of Melamine at 175°C for 300s
Step 2: Do 3-5 shots of Mold conditioner at 175°C for 180s
Step 3: Run 2 shots of dummy shots at 175°C for 90s @ 2 shots
Step 4: Resume production as usual

For more information on epoxy molding compound or other semiconductor consumables, visit us or contact us for more details.

Related Posts

  1. The correct mold cleaning ratio for epoxy Mold Compound (EMC)
  2. Heat Capacity of Epoxy Molding Compound
  3. What percentage of Carnauba Wax Spray is used in Epoxy Mold Compound?

Tags: Epoxy Mold Compound · Semiconductor

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6 responses so far ↓

  • 1 Goardibra // Aug 5, 2010 at 7:46 pm

    test

  • 2 LINQblog // Aug 20, 2010 at 10:10 am

    What is being tested? :)

  • 3 Yazid // Sep 1, 2010 at 3:16 pm

    I’ve read your website regarding the cleaning procedure here.

    I want to ask the type of melamine and conditioner that supposes to be use for the cleaning, thanks.

  • 4 LINQblog // Sep 1, 2010 at 3:30 pm

    @yazid The material most often used in the industry is Nikalet Melamine Mold Compound. Contact us for pellet sizes and prices.

  • 5 steve b. dulay III // Sep 2, 2010 at 4:00 am

    hello! i’m a process engineer in one of the semiconductor companies here in the philippines. the steps 1 – 4 you have posted are the normal die cleaning in semiconductor molding process. but most in the molding process, after die cleaning, after the operator have conducted 2 shots dummy, there are presence of incomplete mold/incomplete filling (or mizyuuten, in japanese term) especially in the corners of each cavity. it will only remove if the operator/technicians/engineers will manually clean the cavity that are affected by using a copper rod. one of our countermeasure is that, we substituted the melamine (cleaning resin) and conditioner (wax resin) with a rubber cleaning materials but after die cleaning using rubber cleaner, there are presence of plastic compound at the walls of each cavity. and again, it will only remove if the operator will clean manually the affected cavity. we use KTMC rubber cleaner here in our company. can you give me other makers or suppliers of rubber cleaning materials? thanks

  • 6 LINQblog // Sep 7, 2010 at 4:10 am

    There are two other manufacturers which we are aware of that our customers use. One is IC Vision mold rubber cleaning sheet (used by several large semiconductor OEMs) and also E-Z Clean, which is from a Korea company

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