Comments on: The proper cleaning procedure after Epoxy Molding Compound

By: LINQblog

LINQblog — Tue, 07 Sep 2010 08:10:32 +0000

There are two other manufacturers which we are aware of that our customers use. One is IC Vision mold rubber cleaning sheet (used by several large semiconductor OEMs) and also E-Z Clean, which is from a Korea company

By: steve b. dulay III

steve b. dulay III — Thu, 02 Sep 2010 08:00:08 +0000

hello! i’m a process engineer in one of the semiconductor companies here in the philippines. the steps 1 – 4 you have posted are the normal die cleaning in semiconductor molding process. but most in the molding process, after die cleaning, after the operator have conducted 2 shots dummy, there are presence of incomplete mold/incomplete filling (or mizyuuten, in japanese term) especially in the corners of each cavity. it will only remove if the operator/technicians/engineers will manually clean the cavity that are affected by using a copper rod. one of our countermeasure is that, we substituted the melamine (cleaning resin) and conditioner (wax resin) with a rubber cleaning materials but after die cleaning using rubber cleaner, there are presence of plastic compound at the walls of each cavity. and again, it will only remove if the operator will clean manually the affected cavity. we use KTMC rubber cleaner here in our company. can you give me other makers or suppliers of rubber cleaning materials? thanks

By: LINQblog

LINQblog — Wed, 01 Sep 2010 19:30:44 +0000

@yazid The material most often used in the industry is Nikalet Melamine Mold Compound. Contact us for pellet sizes and prices.

By: Yazid

Yazid — Wed, 01 Sep 2010 19:16:38 +0000

I’ve read your website regarding the cleaning procedure here.

I want to ask the type of melamine and conditioner that supposes to be use for the cleaning, thanks.

By: LINQblog

LINQblog — Fri, 20 Aug 2010 14:10:05 +0000

What is being tested?

By: Goardibra

Goardibra — Thu, 05 Aug 2010 23:46:38 +0000

test