CAPLINQ LINQTAPE Polyimide Film can be used to sputter metals, including precious metals like Gold (Au) and Titanium (Ti). This may be done for various reasons including:
- Sputtering metals on silicon wafers
- Study the inter-metallic layers formed during metal deposition
- Study the metal-polyimide interface
- Carry out X‑ray photoelectron spectroscopy
The first test is to determine the thermal robustness of the CAPLINQ LINQTAPE PIT1SD and PIT2SD (double-sided, polyimide tape with silicone adhesive; 1mil and 2mil thick backing respectively). For the purpose of wafer metal deposition, Dr. Markus Lützelschwab, an R&D Engineer in the Optics & Packaging department of CSEM (Centre Suisse d’Electronic et de Microtechnique SA) carried out this test in Switzerland. He did some preliminary tests by sticking the PIT1SD and PIT2SD onto a glass container and heating the assembly using a hot-air solder tool. Using this test, he demonstrated that it showed the same thermal robustness as [single-sided] Kapton tape.
After this step, Dr. Lützelschwab sent the wafer with the LINQTAPE polyimide tape for a sputtering process. The LINQTAPE withstood easily the externally conducted sputtering process of Titanium and Gold. Attached is the picture of one corner of the LINQTAPE polyimde tape after sputtering.