CAPLINQ Polyimide Tape used to sputter metals on wafers

CAPLINQ LINQTAPE Poly­imide Film can be used to sput­ter met­als, includ­ing pre­cious met­als like Gold (Au) and Tita­ni­um (Ti). This may be done for var­i­ous rea­sons includ­ing:

  • Sput­ter­ing met­als on sil­i­con wafers
  • Study the inter-metal­lic lay­ers formed dur­ing met­al depo­si­tion
  • Study the met­al-poly­imide inter­face
  • Car­ry out X‑ray pho­to­elec­tron spec­troscopy

TapeSputter
The first test is to deter­mine the ther­mal robust­ness of the CAPLINQ LINQTAPE PIT1SD and PIT2SD (dou­ble-sided, poly­imide tape with sil­i­cone adhe­sive; 1mil and 2mil thick back­ing respec­tive­ly). For the pur­pose of wafer met­al depo­si­tion, Dr. Markus Lützelschwab, an R&D Engi­neer in the Optics & Pack­ag­ing depart­ment of CSEM (Cen­tre Suisse d’Elec­tron­ic et de Microtech­nique SA) car­ried out this test in Switzer­land. He did some pre­lim­i­nary tests by stick­ing the PIT1SD and PIT2SD onto a glass con­tain­er and heat­ing the assem­bly using a hot-air sol­der tool. Using this test, he demon­strat­ed that it showed the same ther­mal robust­ness as [sin­gle-sided] Kap­ton tape.

After this step, Dr. Lützelschwab sent the wafer with the LINQTAPE poly­imide tape for a sput­ter­ing process. The LINQTAPE with­stood eas­i­ly the exter­nal­ly con­duct­ed sput­ter­ing process of Tita­ni­um and Gold. Attached is the pic­ture of one cor­ner of the LINQTAPE poly­imde tape after sput­ter­ing.

For more infor­ma­tion about poly­imide tapes or any oth­er of our prod­ucts, vis­it us or con­tact us for more details.

About Chris Perabo

Chris is an energetic and enthusiastic engineer and entrepreneur. He is always interested in taking highly technical subjects and distilling these to their essence so that even the layman can understand. He loves to get into the technical details of an issue and then understand how it can be useful for specific customers and applications. Chris is currently the Director of Business Development at CAPLINQ.

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