CAPLINQ EUROPE BV SIGNS DEFINITIVE AGREEMENT TO REPRESENT HYSOL EPOXY MOLDING COMPOUNDS IN EUROPE AND THE AMERICAS
Amsterdam, The Netherlands (WEBWIRE) – October 5th, 2020 – CAPLINQ Europe BV announced today that it has become Hysol Huawei Electronics’ “European and American Market Partner” to promote, sell, distribute, and support its products in Europe, the Americas, Middle East and Asia (EMEA). Under the terms of the signed agreement, CAPLINQ will represent Hysol’s Epoxy Molding Compounds (EMC) with a specific focus on the semiconductor-grade epoxy mold compounds used in the packaging of integrated circuits (IC), discrete components ad capacitors.
Hysol offers a wide range of semiconductor-grade EMC
Hysol’s product portfolio covers the entire range of semiconductor devices. The product categories include discrete components, capacitors & resistors, DPAK & D2PAK, Small Outline Integrated Circuits (SOIC), DIP, BGA & laminates, power modules, MAP-molded packages, and Quad Flat Packs (QFP). With new products developed for high-voltage, high-power SiC-based packages, Conductive Polymer Tantalum Capacitors, and MAP-molded packages, these products are based on advanced material technologies with long-term reliability performance for automotive applications.
“We are truly excited about this Market Partnership with Chris Perabo and the CAPLINQ team,” remarked Song Jin, Overseas Technical Sales for Hysol Huawei Electronics. “CAPLINQ’s technical team has a long history with semiconductor packaging and in particular epoxy molding compounds. Their expertise in both the technical support and logistics handling of these special products will be an asset not only to Hysol, but also to our overseas customers on whose production heavily depends on consistent quality and supply of these products.”
A PERFECT FIT
The range of epoxy molding compounds offered by Hysol complements the current semiconductor product offerings as well as the strategic direction of CAPLINQ, whose skills lie in the sales, support and handling of specialty chemicals and plastics for the semiconductor, automotive and renewable energy industries. “Hysol is a global leader in epoxy molding compounds and their product offering perfectly complements the customers and applications we already support,” stated Chris Perabo, Business Development Director of CAPLINQ. “We are honored to be selected as strategic market partner to support this niche business in Europe and the Americas.”
About Hysol Huawei Electronics Co., Ltd
Hysol Huawei Electronics is born out of the 2017 divestiture of Henkel GmbH’s Epoxy Mold Compound business. During the divestiture, Hysol acquired not only the entire range of semiconductor-grade mold compounds, but also the “Hysol” brand name associated with Henkel’s range of performance epoxies. Headquartered in Lianyungang, China, Hysol manufacture in Lianyungang and have an R&D Center and pilot production line in Shanghai, China as well. Building on more than 50 years’ experience, Hysol is one of the original pioneers in the epoxy mold compound industry.
About CAPLINQ Europe BV
CAPLINQ is a specialty chemicals, plastics, and products supplier that specializes in the promotion, support, sales, and supply of materials to eMobility, semiconductor, and industrial customers. With a staff of engineers and technical representatives, CAPLINQ uses digital-age sales and marketing tools combined with cutting-edge logistics services to increase product awareness, provide technical support, and optimize supply chains. We do this with four primary services: Order Fulfillment, Technical Representation, Technical Marketing and REACH Only Representation.