CAPLINQ signs distribution agreement with Hysol in Europe and the Americas

CAPLINQ EUROPE BV SIGNS DEFINITIVE AGREEMENT TO REPRESENT HYSOL EPOXY MOLDING COMPOUNDS IN EUROPE AND THE AMERICAS

Ams­ter­dam, The Nether­lands (WEBWIRE) – Octo­ber 5^th, 2020 – CAPLINQ Europe BV announced today that it has become Hysol Huawei Elec­tron­ics’ “Euro­pean and Amer­i­can Mar­ket Part­ner” to pro­mote, sell, dis­trib­ute, and sup­port its prod­ucts in Europe, the Amer­i­c­as, Mid­dle East and Asia (EMEA). Under the terms of the signed agree­ment, CAPLINQ will rep­re­sent Hysol’s Epoxy Mold­ing Com­pounds (EMC) with a spe­cif­ic focus on the semi­con­duc­tor-grade epoxy mold com­pounds used in the pack­ag­ing of inte­grat­ed cir­cuits (IC), dis­crete com­po­nents ad capacitors.

Hysol offers a wide range of semiconductor-grade EMC

Hysol’s prod­uct port­fo­lio cov­ers the entire range of semi­con­duc­tor devices. The prod­uct cat­e­gories include dis­crete com­po­nents, capac­i­tors & resis­tors, DPAK & D2PAK, Small Out­line Inte­grat­ed Cir­cuits (SOIC), DIP, BGA & lam­i­nates, pow­er mod­ules, MAP-mold­ed pack­ages, and Quad Flat Packs (QFP). With new prod­ucts devel­oped for high-volt­age, high-pow­er SiC-based pack­ages, Con­duc­tive Poly­mer Tan­ta­lum Capac­i­tors, and MAP-mold­ed pack­ages, these prod­ucts are based on advanced mate­r­i­al tech­nolo­gies with long-term reli­a­bil­i­ty per­for­mance for auto­mo­tive applications.

“We are tru­ly excit­ed about this Mar­ket Part­ner­ship with Chris Per­abo and the CAPLINQ team,” remarked Song Jin, Over­seas Tech­ni­cal Sales for Hysol Huawei Elec­tron­ics. “CAPLINQ’s tech­ni­cal team has a long his­to­ry with semi­con­duc­tor pack­ag­ing and in par­tic­u­lar epoxy mold­ing com­pounds. Their exper­tise in both the tech­ni­cal sup­port and logis­tics han­dling of these spe­cial prod­ucts will be an asset not only to Hysol, but also to our over­seas cus­tomers on whose pro­duc­tion heav­i­ly depends on con­sis­tent qual­i­ty and sup­ply of these products.”

A PERFECT FIT

The range of epoxy mold­ing com­pounds offered by Hysol com­ple­ments the cur­rent semi­con­duc­tor prod­uct offer­ings as well as the strate­gic direc­tion of CAPLINQ, whose skills lie in the sales, sup­port and han­dling of spe­cial­ty chem­i­cals and plas­tics for the semi­con­duc­tor, auto­mo­tive and renew­able ener­gy indus­tries. “Hysol is a glob­al leader in epoxy mold­ing com­pounds and their prod­uct offer­ing per­fect­ly com­ple­ments the cus­tomers and appli­ca­tions we already sup­port,” stat­ed Chris Per­abo, Busi­ness Devel­op­ment Direc­tor of CAPLINQ. “We are hon­ored to be select­ed as strate­gic mar­ket part­ner to sup­port this niche busi­ness in Europe and the Americas.”

About Hysol Huawei Electronics Co., Ltd

Hysol Huawei Elec­tron­ics is born out of the 2017 divesti­ture of Henkel GmbH’s Epoxy Mold Com­pound busi­ness. Dur­ing the divesti­ture, Hysol acquired not only the entire range of semi­con­duc­tor-grade mold com­pounds, but also the “Hysol” brand name asso­ci­at­ed with Henkel’s range of per­for­mance epox­ies. Head­quar­tered in Lianyun­gang, Chi­na, Hysol man­u­fac­ture in Lianyun­gang and have an R&D Cen­ter and pilot pro­duc­tion line in Shang­hai, Chi­na as well. Build­ing on more than 50 years’ expe­ri­ence, Hysol is one of the orig­i­nal pio­neers in the epoxy mold com­pound industry.

About CAPLINQ Europe BV

CAPLINQ is a spe­cial­ty chem­i­cals, plas­tics, and prod­ucts sup­pli­er that spe­cial­izes in the pro­mo­tion, sup­port, sales, and sup­ply of mate­ri­als to eMo­bil­i­ty, semi­con­duc­tor, and indus­tri­al cus­tomers. With a staff of engi­neers and tech­ni­cal rep­re­sen­ta­tives, CAPLINQ uses dig­i­tal-age sales and mar­ket­ing tools com­bined with cut­ting-edge logis­tics ser­vices to increase prod­uct aware­ness, pro­vide tech­ni­cal sup­port, and opti­mize sup­ply chains. We do this with four pri­ma­ry ser­vices: Order Ful­fill­ment, Tech­ni­cal Rep­re­sen­ta­tion, Tech­ni­cal Mar­ket­ing and REACH Only Rep­re­sen­ta­tion.