FILLERS ARE THE INGREDIENT THAT MOST AFFECT THE COEFFICIENT OF THERMAL EXPANSION AND THE THERMAL CONDUCTIVITY OF EPOXY MOLDING COMPOUNDS
All molding engineers know that the Thermal Conductivity (TC) and Coefficient of Thermal Expansion (CTE) are important material properties of Epoxy Molding Compounds (EMC). What many of these engineers do not realize is that is it the fillers in the EMC that play the most critical role in how these are ultimately determined.
The reason the fillers so important is because they are the largest single percentage of the ingredients that make up most epoxy mold compounds. This high percentage means that both the CTE and Thermal Conductivity of the final mold compound are largely skewed toward the CTE and TC of the fillers themselves.
One of the most common fillers in the manufacture of EMC is a high purity silica.
The Coefficient of Thermal Expansion (CTE) of epoxy mold compounds (EMC) is controlled by a number of factors, most important of which are the filler properties including:
- Filler type
- Filler size
- Filler percentage (how much is in the resin)
The thermal conductivity of an epoxy mold compound is determined primarily also by the filler properties including:
- Filler type
- Filler Percentage
- Filler size
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