Process to remove cured KJR silicone from IC’s (Decapping)

Shin-Etsu KJR sil­i­cones are used exten­sive­ly in the man­u­fac­ture of ICs, tran­sis­tors, diodes and oth­er semi­con­duc­tor devices.

KJR-4013E is a flex­i­ble, mois­ture-cure sil­i­cone most often used as junc­tion-coat­ing resins in the man­u­fac­ture of diodes. KJR-651E, KJR-655E and KJR-657E are rigid ther­moset poly­imide-sil­i­cones used as junc­tion coat­ing resins in the man­u­fac­ture of high­er pow­er diodes and thyris­tors. Both are used due to their excel­lent adhe­sion to epoxy mold­ing com­pounds (EMC), high humid­i­ty resis­tance, and excel­lent vol­ume resis­tiv­i­ty and dielec­tric break­down prop­er­ties.

To be able to con­duct fail­ure analy­sis, cus­tomers have asked if there is a process to remove the cured sil­i­cone / poly­imide-sil­i­cone from the diodes and/or thyris­tors (decap).

One rec­om­men­da­tion is to use sul­phuric acid (H2SO4) which can nor­mal­ly clear­ly strip organ­ic com­pounds. Nitric acid (HNO3) is anoth­er option. If the dis­solv­ing rate is slow, adding heat to the process helps very much. Of course, for either of these process­es, a fume hood is nec­es­sary all the time.

For more infor­ma­tion of cop­per wire bond­ing, vis­it us or con­tact us for more details.

About Chris Perabo

Chris is an energetic and enthusiastic engineer and entrepreneur. He is always interested in taking highly technical subjects and distilling these to their essence so that even the layman can understand. He loves to get into the technical details of an issue and then understand how it can be useful for specific customers and applications. Chris is currently the Director of Business Development at CAPLINQ.

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