How time and temperature affect spiral flow and viscosity

Redefining Epoxy Mold Compound Shelf-Life

How time and temperature affect spiral flow and viscosity, but not shelf-life

When it comes to epox­ies and specif­i­cal­ly epoxy mold­ing com­pounds (EMC), end users often mis­tak­en­ly define the terms “Shelf Life” and “Expi­ra­tion Date” as the same. The term “Shelf Life” has legal impli­ca­tions (specif­i­cal­ly as it con­cerns sup­pli­ers in the auto­mo­tive sup­ply chain), as a manufacturer’s way of end­ing any war­ran­ty on the material’s final prod­uct properties.

We like to argue that epoxy mold com­pounds nev­er tru­ly expire, and if they can still be processed by the equip­ment required to trans­form it, then the final mate­r­i­al prop­er­ties will nev­er be com­pro­mised. Two prop­er­ties that are affect­ed by time and tem­per­a­tures are Spi­ral Flow and vis­cos­i­ty, but these are pro­cess­ing para­me­ter prop­er­ties and not final prod­uct properties.
As such, this paper argues that epoxy mold com­pound man­u­fac­tur­ers should intro­duce the terms “Spi­ral Flow Behav­ior” and “Vis­cos­i­ty Behav­ior” on their prod­ucts’ tech­ni­cal data sheets. These terms more prop­er­ly qual­i­fy the prop­er­ties that are affect­ed by time and temperature.

The term “Shelf-Life” should not be defined by the way man­u­fac­tur­ers’ cur­rent­ly define it, which is that the mate­r­i­al is with­in a spec­i­fied spi­ral flow range. Rather, shelf-life should be rede­fined by the way their cus­tomers use the term – as an expi­ra­tion date after which the man­u­fac­tur­er ends the war­ran­ty of the material’s final prod­uct prop­er­ties. Doing so would both increase the shelf life of the epoxy mold­ing com­pounds and allow end users to be able to use these prod­ucts, even it means they must adjust the equipment’s pro­cess­ing parameters.

Please stay tuned for the next part in this series to explore the behav­iour of epoxy mold­ing compounds.

Please vis­it us at to learn more about our whole range of epoxy mold­ing com­pounds (EMC) includ­ing our epoxy mold com­pound for semi­con­duc­tors, fiber­glass-rein­forced epoxy mold­ing com­pounds, and opti­cal­ly clear epoxy mold­ing com­pounds (CMC) for opto­elec­tron­ics. If you have any oth­er ques­tions about how to process and cure epoxy mold­ing com­pounds please feel free to leave a com­ment below or don’t hes­i­tate to con­tact us.

About Chris Perabo

Chris is an energetic and enthusiastic engineer and entrepreneur. He is always interested in taking highly technical subjects and distilling these to their essence so that even the layman can understand. He loves to get into the technical details of an issue and then understand how it can be useful for specific customers and applications. Chris is currently the Director of Business Development at CAPLINQ.

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