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Electronics Assembly Adhesives

Conductive and non-conductive adhesives

Available online via Caplinq.com

Electronics Assembly Adhesives

Electronics assembly adhesives are designed to aid in the manufacture of components and materials. These innovative adhesive products facilitate electrical interconnect, provide structural integrity, offer critical protection, and transfer heat for reliable performance. We're proud to offer products that improve today’s electronic technologies and enable tomorrow’s advances.

From Dual cure to UV and Heat cure and from single to multi component solutions there is a product for every given application. Our adhesives are being used in Industrial applications, in Packaging assemblies and in the Automotive and CMOS sensors industries. No matter your challenge, we can help you find a reliable, cost-effective solution, and support you throughout the entire life cycle of your project with a global sales and technical customer service team.

We offer Conductive and Non electrically conductive adhesives that can be used in a broad range of applications. They all deliver optimal performance on their respective applications. The combination of cure types, mix types and properties is endless while we strive to provide newer and better products every single day. Contact us with your application requirements to receive a product suggestions

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24 products
Compare Products
24 products

Frequently Asked Questions


What do I need for a Fingerprint sensor bezel attach?


The key requirements for a fingerprint sensor bezel attach are a good and stable electrical coonection with the metal bezel that cures fast and in a low temperature while also having high adhesion to the metal.

Sounds demanding? Sure.That's why you might want to consider CE3103WLV with a fast thermal cure and high viscosity, ABP 2032S with low temperature cure and high adhesion or finally 2030SCR with lost stress and low temperature cure.

What is the lowest temperature cure adhesive?


Loctite 3220 is a non conductive adhesive designed temperature cure down to 60°C. This multi purpose on component epoxy typically fast cure in 5 to 10 min at 80°C. With 3 weeks work life at 30°C, it manages to have a high adhesion on FR4, Glass and many engineering plastics. Contact us for additional information.


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Electronics Assembly Materials

Henkel’s diverse portfolio of adhesive and sealant solutions includes advanced materials technologies to address today’s most demanding applications. From electrically conductive and non-conductive paste adhesives through to thermally conductive dielectric materials, our product line achieves maximum performance and cost-efficiency.

Our electrically conductive and non-conductive adhesives are ideal for withstanding the thermal and physical stresses of Defense, Automotive, Medical and Consumer Electronic assembly applications, while our spot cure technologies enable high-speed assembly for RFID tags and other printed electronic devices. Non-conductive paste systems in the Henkel portfolio include a series of one- and two-part room temperature, thermal and UV cure adhesives for the ultimate in flexibility and performance.

For manufacturers that require both adhesion and thermal dissipation functionality, our line of thermally conductive dielectric pastes are the most trusted and reliable materials on the market. Providing outstanding adhesion and thermal performance, Henkel offers both shimmed and nonshimmed formulations. For assembly specialists that require the utmost in accuracy, our shimmed adhesives contain engineered spacers for more precise bondline control.