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Compare Epoxy Molding Compounds

Below is summary of all the epoxy molding compounds available via CAPLINQ.com and links to product details which provides you with even more details.

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    •   Summary
  •   General Properties
  • Process Method Transfer Molding Transfer Molding Transfer Molding
    Specific Gravity
    Specific Gravity
    Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

    For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
    1.83
    Color
    Color
    The color
    Black
    Filler Content 80 %
    Shelf Life @ 5°C 365 days
  •   Chemical Properties
  • Chloride (Cl-)
    Chloride (Cl-)
    The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
    20 ppm
    Sodium (Na+)
    Sodium (Na+)
    The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
    20 ppm
  •   Mechanical Properties
  • Flexural Strength @ 25°C
    Flexural Strength @ 25°C
    Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
    157 N/mm2
    Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds 90
    Flexural Modulus @ 25°C 16800 N/mm2
    Molded Shrinkage 0.24 %
  •   Electrical Properties
  • UL Rating Class B (130°C) Class B (130°C) Class B (130°C)
    Volume Resistivity
    Volume Resistivity
    Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
    440000000000000000 Ohms⋅cm
  •   Thermal Properties
  • Gel Time @ 175°C / 347°F 23 s
    Spiral Flow @ 175°C / 347°F 86 cm
    Glass Transition Temperature (Tg)
    Glass Transition Temperature (Tg)
    The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

    The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
    175 °C
    Thermal Conductivity
    Thermal Conductivity
    Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

    Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
    0.5 W/m.K
    Coefficient of Thermal Expansion (CTE), α1
    Coefficient of Thermal Expansion (CTE), α1
    CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

    It explains how much a material will expand until it reaches Tg.
    15 ppm/°C
    Coefficient of Thermal Expansion (CTE), α2
    Coefficient of Thermal Expansion (CTE), α2
    CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

    It explains the extent to which a material will expand after it passes Tg.
    45 ppm/°C
    UL94 @ 1/4 inch V0
  •   Other Properties
  • RoHS Compliant
    RoHS Compliant
    RoHS is a product level compliance based on a European Union Directive which restricts the Use of certain Hazardous Substances in Electrical and Electronic Equipment (RoHS).

    Products compliant with this directive do not exceed the allowable amounts of the following restricted materials: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE), with some limited exemptions
    Yes Yes Yes
  •   Curing Conditions
  • Preheat Temperature 80 - 95 °C
    Molding Temperature 140 - 180 °C
    Transfer Pressure 40 - 85 kg/cm2
    Transfer Time 6 - 15 s
    Curing Time @ 175°C / 347°F 70 - 90 s
    Curing Time @ 175°C / 347°F (Automold) 50 - 70 s
    Post Mold Cure @ 175°C / 347°F 2 - 6 hrs