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Compare Epoxy Molding Compounds

Below is summary of all the epoxy molding compounds available via CAPLINQ.com and links to product details which provides you with even more details.

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    •   Summary
  •    Product Information (Epoxy Molding Compounds)
  • Product SKU MH0689 MH0504 MG0690
    Product Name GR2520 Black Epoxy Mold Compound MH6-0504 Black Epoxy Mold Compound MG33-0690 Black Epoxy Mold Compound
    Process Method
    Specific Gravity
    UL Rating
    epoxy mold compound
    RoHS Compliant
    Color
    Volume Resistivity
    Preheat Temperature
    Molding Temperature
    Transfer Pressure
    Transfer Time
    Glass Transition Temperature (Tg)
    Thermal Conductivity
    Filler Content
    Molded Shrinkage
    Edge Coverage
    solder balls
    Process Method
    solder spheres
    Pb-free
    UL Rating
    epoxy mold compound
    RoHS Compliant
    solder balls
    Process Method
    solder spheres
    Pb-free
    UL Rating
    epoxy mold compound
    RoHS Compliant
    Flexural StrengthFlexural Strength @ 25°C
    Main Category  Plastics, Silicones & Rubbers
    Insulation Materials
    Molding Compounds
    Plastics, Silicones & Rubbers
    Insulation Materials
    Molding Compounds
    Plastics, Silicones & Rubbers
    Insulation Materials
    Molding Compounds
    Gel Time  Gel Time @ 175°C / 347°F
    Spiral Flow  Spiral Flow @ 175°C / 347°F
    Shelf Life  Shelf Life @ 5°C
    Hardness  Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds
    Curing Time  Curing Time @ 175°C / 347°F
    Curing Time @ 175°C / 347°F (Automold)
    Curing Time @ 190°C / 374°F (Automold)
    Post Mold Cure  Post Mold Cure @ 175°C / 347°F
    Coefficient of Thermal Expansion (CTE)  Coefficient of Thermal Expansion (CTE), α1
    Coefficient of Thermal Expansion (CTE), α2
    Flexural Modulus  Flexural Modulus @ 25°C
    Extractable Ionic Content, after 20 hours  Chloride (Cl-)
    Sodium (Na+)
    UL94 Rating  UL94 @ 1/4 inch
    Subcategory  Compression-Grade Molding Compounds
    Transfer-Grade Molding Compounds
    Epoxy Molding Compounds
    Molding Compounds
    Insulation Materials
    High Tg & Ultra-High Tg Epoxy Mold Compounds
    Compression-Grade Molding Compounds
    Transfer-Grade Molding Compounds
    Epoxy Molding Compounds
    Molding Compounds
    Insulation Materials
    Anhydride-cured Epoxy Mold Compounds
    Compression-Grade Molding Compounds
    Transfer-Grade Molding Compounds
    Epoxy Molding Compounds
    Molding Compounds
    Insulation Materials
  •   General Properties
  • Process Method Transfer Molding Transfer Molding Transfer Molding
    Specific Gravity 1.83
    Color Black
    Filler Content 80 %
    Shelf Life @ 5°C 365 days
  •   Chemical Properties
  • Chloride (Cl-) 20 ppm
    Sodium (Na+) 20 ppm
  •   Mechanical Properties
  • Flexural Strength @ 25°C 157 N/mm2
    Hot Hardness, Shore D @ 175°C / 347°F after 90 seconds 90
    Flexural Modulus @ 25°C 16800 N/mm2
    Molded Shrinkage 0.24 %
  •   Electrical Properties
  • UL Rating Class B (130°C) Class B (130°C) Class B (130°C)
    Volume Resistivity 440000000000000000 Ohms⋅cm
  •   Thermal Properties
  • Gel Time @ 175°C / 347°F 23 s
    Spiral Flow @ 175°C / 347°F 86 cm
    Glass Transition Temperature (Tg) 175 °C
    Thermal Conductivity 0.5 W/m.K
    Coefficient of Thermal Expansion (CTE), α1 15 ppm/°C
    Coefficient of Thermal Expansion (CTE), α2 45 ppm/°C
    UL94 @ 1/4 inch V0
  •   Other Properties
  • RoHS Compliant Yes Yes Yes
  •   Curing Conditions
  • Preheat Temperature 80 - 95 °C
    Molding Temperature 140 - 180 °C
    Transfer Pressure 40 - 85 kg/cm2
    Transfer Time 6 - 15 s
    Curing Time @ 175°C / 347°F 70 - 90 s
    Curing Time @ 175°C / 347°F (Automold) 50 - 70 s
    Post Mold Cure @ 175°C / 347°F 2 - 6 hrs