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Addressing the requirements for both laminate and leadframe wirebond packages, Henkel has developed a comprehensive portfolio of advanced conductive die attach materials for various wirebond requirements – from smaller die-to-pad ratios to thinner bond lines to low stress to high temperature capability and robust adhesion. As the market share leader and top innovator of the most advanced die attach solutions, Henkel’s LOCTITE ABLESTIK portfolio delivers exceptional die packaging reliability performance and meets the highest JEDEC MSL standards.
Laminate Packaging Materials
A broad selection of electrically conductive LOCTITE ABLESTIK conductive die attach paste formulations provide the reliability and performance today’s high-density laminate packages demand. Each package type – from BGAs to LGAs to Smart Cards – has different requirements, which is why Henkel has developed a suite of products that cater to the unique needs of laminate-based devices. Henkel conductive die attach pastes offer a low modulus for stress reduction and warpage elimination, as well as Bismaleimide (BMI) formulations for low moisture absorption to avoid package cracking during high temperature processing.
Leadframe Packaging Materials
Process flexibility and superior performance underscore Henkel’s complete portfolio of conductive die attach pastes for leadframe devices. Incorporated into applications such as automotive electronics, where temperature control and unfailing function are critical, LOCTITE ABLESTIK die attach pastes deliver high thermal conductivity and high reliability. Robust adhesion to various metal surfaces including palladium, copper, silver, gold and PPF along with proven low-bleed formulas make Henkel’s die attach materials the products of choice for leadframe packaging specialists
Conductive Wafer Backside Coatings
Henkel’s novel Wafer Backside Coating materials allow for screen or stencil printing of the paste across the entire wafer in a single stroke, increasing throughput by eliminating the need to individually dispense dots of adhesive. After B-staging to create a film, Wafer Backside Coating provides consistent bond lines and small, controlled fillets, which are particularly effective for attaching small die in miniaturized packages and challenging structures like chip-on-lead, where the die pad is smaller than the die.