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Conductive Die Attach Paste

Silver-filled die attach pastes for copper, Ag-spot, NiPdAu and other metal leadframe applications

Electrically Conductive Die Attach Paste

Product Selector Guide

Conductive Die Attach Pastes
Product Description Key attributes Die size Substrate finish Moisture sensitivity level, MSL Volume resistivity (Ohm-cm) Thermal conductivity (W/m-k) Recommended cure
Loctite Ablestik 2000 Ag-filled die attach adhesive - Low bleed
- Low stress
- Ultra-low moisture absorption
- Fast oven cure with no voids
<12X12 Solder mask or Au L2 260°C Capable 5.0X10-4 1.2 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 2100A Ag-filled die attach adhesive - Low bleed
- Low stress
- Oven cure
<12X12 Solder mask or Au L2 260 °C Capable 5.0X10-2 1.2 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 2300
Ag-filled die attach adhesive - Low bleed
- Low stress
- Excellent dispensability
- Low voiding
- Oven cure
<12X12 Solder mask or Au L2 260 °C Capable 5.0X10-2 0.6 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 2700HT
Ag-filled die attach adhesive - excellent bleed performance
- long work life
- strong hot/wet adhesion to Au
- Ideal for small needle dispensing
- Oven cure
<8X8 Solder mask, Ag or Au L3 260 °C Capable 3.0X10-5 11.0 30 min. ramp and 30 min. hold at 175°C in nitrogen
Loctite Ablestik ABP 2030SCR
Ag-filled die attach adhesive - Low stress
- Compatible with dam & fill encapsulates
- Excellent dispensing performance for high throughput application
- Snap cure
<8X8 Solder mask, Ag, Au or plastics L3 260 °C Capable 2.0X10-4 2.0 120 sec. at 120°C
Loctite Ablestik ABP 2032S Ag-filled, epoxy die attach adhesive - Low Bleed
- Very low stress
- White color for vision recognition
- Widely used for stacked die
- Fast oven cure
<10X10 Solder mask, Ag, Au, steel or plastics L3 260 °C Capable 2.0X10-4 1.0 60 min. at 80°C
Non-Conductive Die Attach Pastes
Product Description Key attributes
Dicing tape Film tickness (um) Wafer thickness (um) Moisture sensitivity level, MSL Modulus at 25°C (MPa)
Loctite Ablestik ATB 100 Series
Silica-filled, rubberized epoxy die attach adhesive -Compatible with Cu wire or Au wire packages
-good adhesion onto low density fiberboard (LDF)
-Compatible with with sealth dicing before grind (SDBG) process
-Oven cure
Non-UV 15, 20, 25 or 30 Up to 75 L2 260 °C Capable 1,170
Loctite Ablestik ATB 100HA Series Silica-filled, epoxy die attach adhesive - Consistent dicing and die pickup for large die applications
- Compatible with stealth dicing before grind (SDBG) process
- SkipCure
UV/Non-UV 5, 10, 15, 20, 25 or 30 Up to 50 L1 260 °C Capable 2,299
Loctite Ablestik ATB 100U Series Silica-filled, rubberized epoxy die attach adhesive - Compatible with CU wire or Au wire packages
- Compatible with sealth dicing before grind (SDBG) process
- Fast oven cure
Non-UV 5, 10, 15, 20, 25 or 30 Up to 75 L2 260 °C Capable 875
Loctite Ablestik ATB 100US Series Silica-filled, epoxy die attach adhesive - Long thermal budget (4 hr.at 175 °C)
- Consistent dicing and die pickup for large die applications
- SkipCure during molding process
UV/Non-UV 5, 10, 15, 20, 25 or 30 Up to 50 L2 260 °C Capable 1,277
Loctite Ablestik ATB F100E Series Silica-filled, epoxy die attach adhesive -suitable for small to large die
- Excellent workability for below 3mm x 3mm die
- Long work life (4 months before and after lamination
- Compatible with stealth dicing before grind (SDBG) process
- Film over wire (FoW) and film over die (FoD) applications
- Oven cure
UV/Non-UV Up to 75 L1 260 °C Capable 5,256
Conductive Die Attach Film Product Selector
Product Description Key attributes
Film tickness (um) Moisture sensitivity level, MSL Thermal conductivity (W/m-k) In-package thermal resistance (K/W)
Loctite Ablestik CDF 600P series
Ag-filled die attach adhesive - Low stress and excellent wetting for large die
- Compatible with various metal surfaces, including solder
- Recommended for thin wafer handling applications
- Oven cure
25 L2 260°C Capable 1 2.1
Conductive Die Attach Paste Product Selector
Product Description Key attributes
Die size Substrate finish Moisture sensitivity level, MSL Volume resistivity (Ohm-cm) Thermal conductivity (W/m-k) Recommended cure
Loctite Ablestik 2000
Ag-filled die attach adhesive - Low bleed
- Low stress
- Ultra-low moisture absorption
- Fast oven cure with no voids
<12X12 Solder mask or Au L2 260°C Capable 5.0X10-4 1.2 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 2100A
Ag-filled die attach adhesive - Low bleed
- Low stress
- Oven cure
<12X12 Solder mask or Au L2 260 °C Capable 5.0X10-2 1.2 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 2300
Ag-filled die attach adhesive - Low bleed
- Low stress
- Excellent dispensability
- Low voiding
- Oven cure
<12X12 Solder mask or Au L2 260 °C Capable 5.0X10-2 0.6 30 min. ramp and 15 min. hold at 175°C
Loctite Ablestik 2700HT
Ag-filled die attach adhesive - excellent bleed performance
- long work life
- strong hot/wet adhesion to Au
- Ideal for small needle dispensing
- Oven cure
<8X8 Solder mask, Ag or Au L3 260 °C Capable 3.0X10-5 11.0 30 min. ramp and 30 min. hold at 175°C
in nitrogen
Loctite Ablestik ABP 2030SCR
Ag-filled die attach adhesive - Low stress
- Compatible with dam & fill encapsulates
- Excellent dispensing performance for high throughput application
- Snap cure
<8X8 Solder mask, Ag, Au or plastics L3 260 °C Capable 2.0X10-4 2.0 120 sec. at 120°C
Loctite Ablestik ABP 2032S Ag-filled, epoxy die attach adhesive - Low Bleed
- Very low stress
- White color for vision recognition
- Widely used for stacked die
- Fast oven cure
<10X10 Solder mask, Ag, Au, steel or plastics L3 260 °C Capable 2.0X10-4 1.0 60 min. at 80°C
Wafer Back Coating Die Attach Product Selector
Product Description Key attributes Die size (mm) Substrate finish moisture sensitivity level, MSL Modulus at 25°C (MPa) CTE (ppm/°C)
below T g
Above Tg Recommended cure
Loctite Ablestik WBC 8901UV Die attach wafer backside coating adhesive - Wide process windows
- 5 to 60 um bondline control
- Low viscosity before B-stage
- Can be spray coated on dicing before grinding (DBG) wafers
- UV B-stage and oven cure
<1X1 Solder mask, Cu, Ag or Au L2 260°C capable 3585 45 142 15 min. ramp and 30 min. hold at 90°C + 4 min. ramp and 45 min. hold at 120°C

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Die Attach Adhesives