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Electrically Conductive Adhesives (ECAs) have been used for high-reliability applications such as automotive, medical and telecom products, but we also offer Electrically conductive adhesives that are non-noble metal compatible, which are ideal for handheld consumer devices. ECAs are lead-free solder alternatives for active and passive component attachment.
Henkel’s electrically conductive LOCTITE® adhesives offer strong component and PCB interconnections for on-demand, long-term, and reliable performance. A broad portfolio of ECAs in paste mediums are formulated using a variety of base chemistries including acrylate, epoxy and silicone platforms, designed to provide manufacturers with choice and flexibility for varying application requirements.
ECAs are designed to provide reliable interconnects and to be used for applications that require very fast cure at low temperatures. Most adhesives are multipurpose and can potentially be used as Encapsulants, die attach or even Underfills.
Epoxy adhesive for SMD component attach on Sn, Sn/Pb and OSP coated Cu substrates
Below is a list of frequently asked questions about the electrically conductive materials we supply. The list is far from exhaustive, so if you have a question, please contact us and we'll see if we can help you with your question.
Nearly all ECAs and conductive die-attach materials will form a conductive bond with aluminum. However, the bond will degrade (higher electrical conductivity and lower adhesion) with aging time, due to progressive oxidation of the aluminum. The degradation may not be a concern for “consumer” devices, where the operating environment may not be very harsh, the operating life is short, and/or the performance requirements are not severe.
None of the current products we offer can guarantee high-reliability long-term on aluminum substrates (especially the conductivity will suffer). There have been product development projects in the past to develop an ECA that was filled with very sharp filler flakes to punch through the oxidation layer of the aluminum substrate, but also this did not work in the end and the project was abandoned.
Silicone materials are challenging as they have very low surface tension (like PTFE) preventing good wetting of the adhesive. Silicones are also chemically resistant, meaning that you can’t use any solubility to melt or diffuse into the polymer matrix like you can with other materials such as polyamide (PA). Moreover, silicones are usually flat or smooth, so you can’t interlock with the roughness. Last but not least, no substrate can be bonded to an adhesion level that is higher than the substrate’s tensile strength or modulus. This means that elastomers like silicone which have low modulus like 2-5 MPa will simply deform and peel when the adhesive load gets higher than these levels. Obviously, if the tensile strength is low, then you will get substrate failure at that level before you reach adhesive failure. The net effect of all of these effects is that the bond strength to silicone with any adhesive is typically limited to less than 1 MPa, meaning “non-structural” level for engineering designs that require a reliable bond.
However, taking these aspects into account, silicones can be bonded with .... silicones ! But in that case the adhesion strength limitation (or failure mode) may be moving to the metal substrate side. If the required adhesive strength is relatively low, you can consider silicone based adhesives like LOCTITE SI 5140 and SI 5145 that are RT vulcanizing or LOCTITE ABLESTIK ABP 8035 that is heat curable.
The choice of chemistry will depend on the final properties of the adhesive that you are trying to maximize.
Silicones are ideal for higher temperature applications or if you also desire high-flexibility or high-elongation in your application. Acrylics or acrylates are best if you desire a very fast cure, or if you want the lowest contact resistance. Epoxies have a good balance between electrical performance, high reliability or low CTE and Tg combinations.
Electrically conductive adhesives are ideal for use in thermal, electrical interconnect and structural bonding applications for improved reliability in electronic systems.
For manufacturers that require both electrical performance and thermal dissipation functionality, Henkel’s electrically conductive materials are the most proven, trusted adhesives on the market.
Snap curable conductive adhesives provides excellent adhesion and reliability, cure times of less than two minutes, and in-line processing capability for exceptionally high throughput. For applications with large coefficient of thermal expansion (CTE) mismatches between substrates, or fine-pitch flip-chip interconnections where electrical conductivity is desired in only one direction, Henkel has an electrically conductive adhesive to meet the challenge.
Electrically conductive heat cure adhesives are required for a number of manufacturing challenges such as die to substrate bonding, passive component attach and the bonding of heat-sensitive components. The Henkel line includes products from such trusted brands as LOCTITE® ECCOBOND and LOCTITE® ABLESTIK, , with varying cure speeds, viscosity and pot life.
Our electrically-conductive adhesive products cure at room temperature and can be used for bonding and sealing applications for heat-sensitive devices that require superior electrical and mechanical properties, with no heating equipment required.
Two-component electrically conductive adhesives require no refrigeration or freezer storage and include products that provide high peel and tensile lap shear strength over a broad temperature range; as well as silver-filled epoxies recommended for electronic bonding and sealing applications that comply with the requirements of NASA’s outgassing specification.