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Epiform F472 | Black Busbar coating powder

Main features
  • Busbar coating
  • Can be used for Coil impregnation
  • Excellent insulation properties

Product Description

Epiform F-472 is a one component insulating epoxy powder resin, used for busbar coating while it can also be used for coil impregnation and iron core coating. It is a premixed, easy to use product that provides excellent flexibility and flame resistance and is suitable for busbars where a large distortion occurs at the time of installation.

Epiform F-472 is designed to insulate electric parts. It offers excellent electric resistance (1x1016 Ω/cm) and breakdown voltage (18 kV/0.5mm) while also achieving a V0 value in a UL94 vertical burn test.

Cure condition

  • 5 min @ 190°C (flexible in a range between 130 - 200°C)
Product Family
12 kg

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Shipping in 8 - 12 weeks Shipping in 8 - 12 weeks

Technical Specifications

General Properties
Bulk Density
Bulk Density
The amount of a certain product that comes in a bulk.
0.65 g/cm3
Mechanical Properties
Hardness is a dimensionless quantity. There is no direct relationship between measurements in one scale and their equivalent in another scale or another hardness test.
Durometer (Shore D) 75
Impact Strength 300 mm
Shear strength
Shear Strength 15 N/mm2
Electrical Properties
UL Rating V0
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
1.0x1016 Ohms⋅cm
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
110 °C