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(Ultra-) High Tg Epoxy Mold Compound

Epoxy molding compounds with high glass transition temperature (Tg)

Ask CAPLINQ. Epoxy Mold Compound Experts.

High Tg & Ultra-High Tg Epoxy Mold Compounds

Standard epoxy molding compounds (often called EMC or duroplast) typically have a glass transition temperature (Tg) between 105°C and 165°C. For many if not most applications, this Tg is sufficient. However, as semiconductor chips evolve from silicon (Si) to silicon carbide (SiC) and operating environments become hotter as automotive applications become hotter, the need for higher glass transition temperatures also increases.

High glass transition temperatures for an epoxy molding compounds

There is no black and white definition for what is considered a high glass transition temperature for epoxy molding compounds,

but we will consider epoxy molding compounds with a Tg above 170°C to be High Tg epoxies, and those with a glass transition temperature above 200°C to be ultra-high Tg.

Please continue to our Learn More section to learn more about what gives an epoxy molding compound its high glass transition temperature, what can be done to increase the Tg of epoxy molding compounds higher (and even above 200°C) and how to best select a high or very high Tg epoxy molding compound.

Read More about High Tg & Ultra-High Tg Epoxy Mold Compounds

Product Selector Guide

High Tg & Ultra-High Tg Epoxy Molding Compounds
Product
Part#
Product
Description
Epoxy
Type
Key Mechanical Properties
Tg
°C
CTE,
Alpha 1
ppm/°C
CTE
Alpha 2
ppm/°C
Flexural Modulus
@25°C
GPa
Flexural Strength
@25°C
MPa
Moisture Absorption
%
Molded Shrinkage
%
CAPLINQ Product Selector Guide and Property Overview of High and Ultra-High Glass Transition Temperature (Tg) Epoxy Molding Compounds
LinqSol® is a registered trademark of CAPLINQ Corporation
Linqsol 700-0140R Halogen-containing EMC A+B / Anhydride 190°C 20 74 13,000 115 0.65 0.17
Linqsol G700-2 Halogen-free, 1st generation A+B+C / Anhydride 235°C 14 55 18,500 120 0.37 0.17
Linqsol G700-2C Halogen-free, 2nd generation BisA/LWA/Anhydride 207°C 18 46 14,015 118 0.50 TBD
Linqsol G700-2D Halogen-free, 3rd generation MFN/LWA 222°C 14 36 15,100 121 0.35 TBD
BisA: Bisphenol A Epoxy Resin
MFN: Multi-Functional Epoxy Resin
MAR: Multi-Aromatic Epoxy Resin
EOCN: Epoxy o-cresol Novolac Resin
DCPD: Dicyclopentadiene Epoxy Resin
LWA: Low Water Absorption

Frequently Asked Questions

Frequently Asked Questions about High Glass Transition Temperature Epoxy Molding Compounds

What is the highest Tg possible for an EMC?

Base epoxies probably have a current maximum Tg of around 255°C. When combined with other resins, hardeners and polymers, we have seen thermosetting polymers such as our Linqsol QSI 900HT, with a Tg as high as 454°C, though this material is not designed for semiconductor encapsulation.

Can Epoxy Mold Compounds be used in applications that are above their Tg?

Absolutely. An epoxy's glass transition temperature is not the same as its maximum operating temperature. Some materials, such as silicones have glass transition temperatures that rare low, or even negative and yet can have maximum operating temperatures higher than epoxies.


Learn More

The glass transition temperature (Tg) of an Epoxy Mold Compound

As explained in the article on how epoxy mold compounds cure, the glass transition temperature (Tg) of an epoxy molding compound is the temperature above which epoxy properties, specifically the coefficient of thermal expansion (CTE) and the dynamic modulus (E), change.

As you can see in Figure 1, the glass transition temperature, though often presented on technical datassheets as a single value is actually more accurately defined as a range. On the left side of the range, the epoxy mold compounds exhibit a hard or glassy behavior, characterized by a high modulus, high hardness and high stiffness. On the right side of the glass transition temperature the epoxy mold compound has a lower modulus, lower hardness and lower stiffness.

Similarly, the lower line represents the dimension or volume of the EMC. On the left of the glass transition region, the coefficient of thermal expansion (CTE), measured in parts per million per degree Celcius (or ppm/°C) is linear and its rate ofd expansion increases more slowly. On the right side of the Tg region, the CTE increases much more quickly, typically 3 to 4 times as much in the case of epoxy molding compounds.

Epoxy Mold Compound Properties affected by Glass Transition Temperature
Figure 1. Epoxy Mold Compound Properties affected by Glass Transition Temperature (Tg)

Solder wire needs flux. Flux removes oxidation.

Read the article on how to measure the Tg of epoxy mold compounds

Solder Needs Flux. The technology of how flux and solder is applied has evolved and continues to develop.
Solder Needs Flux. The technology of how flux and solder is applied has evolved and continues to develop

High & Ultra-High Tg EMCs

CAPLINQ offers a range of high glass transition temperature epoxy molding compounds. Follow the link to compare some of our highest Tg EMCs.

Technical Papers & Brochures

CAPLINQ offers a wealth of Technical Papers, Marketing Brochures, Technical Data Sheets and SDS covering Epoxy Molding Compounds.

Read our Blog on EMC

We try to post as much information as we can on our blogs, to help you find more relevant information about epoxy modling compounds.

Compare and Select the Epoxy Mold Compounds you Need

Whether you are looking for lead-free solder spheres or Tin-Lead solder spheres, our Solder Sphere selector tool can help you choose the right solder sphere for your application.