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HT3500 | One part Hybrid Thermal Gel

Harmonization Code : 3824.99.96.99 |   Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other
HT3500 | One part Hybrid Gap Filler
HT3500 | One part Hybrid Gap Filler
HT3500 | One part Hybrid Gap Filler
Main features
  • Dark Red
  • 3.5 Thermal Conductivity
  • High flow rate

Product Description

HT3500 silicone based one-part Gap Filler - thermal gel provides a thermal conductivity of 3.5 W/mK along with high conformability and high compressibility. It is formulated to deliver high dispense rates for improved productivity, long-term reliability performance and easy reworkability.

HT3500 is designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing, and provide scalable application at a competitive cost. The minimum bondline thickness that it can reach is 0.1mm with a Thermal Impedance of 0.4. Additionally it performs great in oil,crack and slump testing and it exhibits no pump out and cracking risk.

Product Family
HT3500  
280cc Al cartridge

Catalog Product

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Not Available Shipping in 8 - 12 weeks
Packaging
TDS & SDS
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Technical Specifications

General Properties
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 3.2
Color
Color
The color
 Dark Red
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 25°C 365 days
Thermal Properties
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 3.5 W/m.K
Thermal Impedance 0.35 °C·cm²/W