HT 5010 | One part Hybrid Thermal Gel

Harmonization Code : 3824.99.96.99 | Prepared binders for foundry moulds or cores; chemical products and preparations of the chemical or allied industries (including those consisting of mixtures of natural products), not elsewhere specified or included : Other : Other: Other

Main features

Gray
5.2 Thermal Conductivity
Best performing mid range TIM

Product Description

Honeywell HT5010 silicone based one-part thermal gel - Gap Filler provides a thermal conductivity of 5.2 W/m·K along with high conformability and high compressibility. It is one of the most popular thermal gels, formulated to deliver high dispense rates for improved productivity, long-term reliability performance and easy reworkability. The thickness range to prevent slumping in vertical position is 0.3-1.5mm. This is a non factor when components are mounted horizontally.

Honeywell HT5010 is designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing, and provide scalable application at a competitive cost. The minimum bondline thickness that it can reach is 0.14mm with a Thermal Impedance of 0.28. Additionally it performs great in oil, crack and slump testing and it exhibits no pump out and cracking risk.

Honeywell HT5010 has a flow rate above 14 g/min, high breakdown strength (above 5 kV/mm) and very low out gassing (below 0.05%). HT 5010 is the improved version of the discontinued HT 5000. HT 5010 has been formulated to outperform competitive products such as TCXX by all metrics. Better dispense rate, better thermal conductivity and smaller bondline thickness. This, combined with minimal oil bleeding in RT and 80°C and minimal dripping and cracking, makes HT5010 the best product in the mid range, one part hybrid, thermal interface material category.

Specifications
Additional Information

Technical Specifications

General Properties

Color

Color
The color

Gray

Specific Gravity

Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.

3.4

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 25°C	365 days

Outgassing
TML TML Total Mass Loss	0.05 %

Electrical Properties

Dielectric Strength

Dielectric Strength
Dielectric strength is measured in kV per mm and is calculated by the Breakdown voltage divided by the thickness of the tested material.

Those two properties go hand in hand and while Breakdown voltage is always thickness dependent, dielectric strength is a general material property.

As an example, the dielectric strength of Polyimide is 236 kV/mm. If we place 1mm of Polyimide between two electrodes, it will act as an insulator until the voltage between the electrodes reaches 236 kV. At this point it will start acting as a good conductor, causing sparks, potential punctures and current flow.

8 kV/mm

Thermal Properties

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

5 W/m.K

Thermal Impedance

0.28 °C·cm²/W