Hysol MG57F-0660 | Gold Epoxy Mold Compound

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Gold epoxy mold compound
  • Laser Markable
  • Designed for MnO2 Tantalum Capacitors

Product Description

Hysol MG57F-0660 is a gold-colored, environmentally friendly “green” (no bromine/antimony or phosphorous) molding compound. It has been designed especially for use in high volume molding of Manganese Oxide MnO2 tantalum capacitors. It offers excellent moldability with faster cycle times than most traditional epoxy based encapsulants and is especially recommended for automold applications.

Hysol MG57F-0660 also offers excellent contrast with currently available laser marking equipment making it ideal for laser marking product information on the component.

Curing Time

  • 20 to 35 seconds @170°C
  • 30 to 60 seconds @150°C

Post Cure

  • 2 hours @150°C

 

Product Family
MG57F-0660 Gold  
Pellet
40 mm
40 gr
15 kg

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Color
Color
The color
 Gold
Specific Gravity
Specific Gravity
Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
 1.82
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 60 days
Chemical Properties
Ionic Content
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 20 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 20 ppm
Moisture absorption 0.42 %
Mechanical Properties
Flexural Modulus
Flexural Modulus @ 25°C 14500 N/mm2
Flexural Strength
Flexural Strength @ 25°C
Flexural Strength @ 25°C
Flexural strength, also known as modulus of rupture, or bend strength, or transverse rupture strength is a material property, defined as the stress in a material just before it yields in a flexure test. This is the flexural strength tested at Room Temperature, 25°C
 143 N/mm2
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 3.5x1016 Ohms⋅cm
Thermal Properties
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 21 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 70 ppm/°C
Gel Time
Gel Time
Gel time is the time it takes for a material to reach such a high viscosity (gel like) that it is no longer workable.

It is usually measured for different temperature conditions and even though it does not refer to full cure it is advisable to never move or manipulate the material after it reached its gel time since it can lose its desired end properties.
Gel Time @ 175°C / 347°F 14 s
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 168 °C
UL 94 Rating
UL 94 Rating
Flammability rating classification.
It determines how fast a material burns or extinguishes once it is ignited.

HB: slow burning on a horizontal specimen; burning rate less than 76 mm/min for thickness less than 3 mm or burning stops before 100 mm
V-2: burning stops within 30 seconds on a vertical specimen; drips of flaming particles are allowed.
V-1: burning stops within 30 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
V-0: burning stops within 10 seconds on a vertical specimen; drips of particles allowed as long as they are not inflamed.
5VB: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may develop a hole.
5VA: burning stops within 60 seconds on a vertical specimen; no drips allowed; plaque specimens may not develop a hole
 V0
Curing Conditions
Curing Schedule
Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.
Curing Time @ 150°C / 302°F 30 - 60 s
Curing Time @ 175°C / 347°F (Conventional Mold) 20 - 35 s
Mold Temperature 175 - 190 °C
Preheat Temperature 70 - 90 °C
Post Mold Cure
Post Mold Cure @ 175°C / 347°F 2 hrs
Transfer Pressure 40 - 100 kg/cm2
Transfer Time 5 - 30 s

Additional Information

Applications

Short Description of Hysol MG57F-0660 | Gold Epoxy Mold Compound

Typical applications and uses of Hysol MG57F-0660 | Gold Epoxy Mold Compound include:

  • MnO2 Tantlaum Capacitors
  • Other tantalum capacitor packages

Technical Datasheets for Hysol MG57F-0660 | Gold Epoxy Mold Compound

TDS (English) Kapton_Technical_Data_Sheet Click to access Hysol MG57F-0660 | Gold Epoxy Mold Compound Technical Data Sheet
*Note that only registered users may access technical datasheets

Packaging Details

Packaging Details for Hysol MG57F-0660 | Gold Epoxy Mold Compound

The following information is specifically related to each unit of measure of Hysol MG57F-0660 | Gold Epoxy Mold Compound. If you which to compare this to other product sizes, click on the respective product from the list above and check here for values specific to that product. These values are taken from our internal database and are used in the calculation of the gross weight and packaging dimensions of the goods during shipping. You can use these values to approximate delivery charges using your own carrier.