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LINQALLOY Bi57Sn42Ag1| Solder paste

Harmonization Code : 8001.20 |   Unwrought tin: Tin alloys
Main features
  • Sn42Bi57Ag1 Alloy
  • 138°C Eutectic
  • Powder size: T3 (25-45um) and T4 (20-38um)

Product Description

LINQALLOY Bi57Sn42Ag1 is a low Eutectic temperature Solder paste. It meets the requirements of low temperature welding and is widely used in LED assembly, radiator welding, cell phone signal lines and other industries. It offers excellent appearance and soldering results. 

LINQALLOY Bi57Sn42Ag1 has good spread and wetting properties on different materials. It has excellent fine pitch printing capabilities for SMT with no slumping and offers a long operational life. 

Product Family
LASP-Bi57Sn42Ag1  
T3 powder
0.5Kg Jar

Catalog Product

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Packaging
TDS, SDS & Technical documents

Technical Specifications

General Properties
Alloy Type
Alloy Type
A metallic element type
 Sn42Bi57Ag1
Metal Loading
Bismuth (Bi)
Bismuth (Bi)
Bismuth is a chemical element with symbol Bi and atomic number 83. Bismuth is the most naturally diamagnetic element, and has one of the lowest values of thermal conductivity among metals.
 57 %
Silver (Ag) 1 %
Tin (Sn) 42 %
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C 180 days
Thermal Properties
Melting Temperature
Melting temperature 138 °C