LINQALLOY Bi57Sn42Ag1| Solder paste

Harmonization Code : 8001.20 | Unwrought tin: Tin alloys

Main features

Sn42Bi57Ag1 Alloy
138°C Eutectic
Powder size: T3 (25-45um) and T4 (20-38um)

Product Description

LINQALLOY Bi57Sn42Ag1 is a low Eutectic temperature Solder paste. It meets the requirements of low temperature welding and is widely used in LED assembly, radiator welding, cell phone signal lines and other industries. It offers excellent appearance and soldering results.

LINQALLOY Bi57Sn42Ag1 has good spread and wetting properties on different materials. It has excellent fine pitch printing capabilities for SMT with no slumping and offers a long operational life.

Specifications

Technical Specifications

General Properties

Alloy Type

Alloy Type
A metallic element type

Sn42Bi57Ag1

Metal Loading
Bismuth (Bi) Bismuth (Bi) Bismuth is a chemical element with symbol Bi and atomic number 83. Bismuth is the most naturally diamagnetic element, and has one of the lowest values of thermal conductivity among metals.	57 %
Silver (Ag)	1 %
Tin (Sn)	42 %

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	180 days