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LinqSil™ Series mold release agents are high-performance, high operating temperature mold release agents designed to release epoxy, epoxy mold compounds, polyurethane, polyester resins, EPDM, nitrile, thermoplastics and flexible or rigid integral foams from their molds. Used extensively in the semiconductor passive device industry, LinqSil™ S-100 Series is an effective and versatile mold release agent for epoxy mold compounds.
Despite being silicone-based, LinqSil™ S-100 Series mold release agent is completely compatible with epoxy molding compounds, as well as liquid hot- and cold-curing epoxy-, polyurethane and polyester resins. For EPDM, Nitrile and thermoplastic molding, please refer to LinqSil S-200, and for flexible or rigid integral foams, please refer to LinqSil S-300.
LinqSil S-100 has been designed not to char or burn at high temperatures, making it extremely well suited for high temperature molding. It has been used successfully in applications running as hot as 200C. Despite being extremely well suited to high temperature applications, no heat-treatment is required to activate the mold release, so it it equally well-suited to cold-curing or room-temperature curing chemistries.
LinqSil S-100 can be used even with complicated moldings, to achieve perfect separation. It builds on any mold, which is why expensive mold cleanings remain limited to a minimum. Contours and dimensional stability of the forms are not altered by LinqSil S-100. It is equally good for use on metal as well as plastic molds.