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CAPLINQ LINQSTAT™ MVCF-Series is a black, carbon-filled, electrically conductive polyethylene plastic film designed to provide both physical and static protection. Having a surface resistance of <50,000 ohm-cm,
(5 x 10^4 Ω-cm) it offers medium-level static protection which means it effectively avoids accumulation of electric charge on itself and the products which it protects. Its easy-grounding nature makes it ideal for packaging where electrostatic contamination is a problem.
Please note that of the Caplinq Linqstat MVCF-Series the MVCF-8S10K-Series is only surface conductive and not volume conductive.
CAPLINQ LINQSTAT™ MVCF-Series is useful in applications where the key is to balance cost versus performance. As a medium-level conductive plastic, the carbon-loading is such that it is low-enough to be cost-effective, while being high enough to meet the electrical requirements of military specification MIL-PRF-81705D Type II and MIL-P-82646A.
CAPLINQ LINQSTAT™ MVCF-Series film and its conductivity are unaffected by humidity and age. The film is heat-sealable, flexible and offers exceptional abrasion resistance. The film gives good thermal stability and has outstanding chemical resistance. It has a standard thickness range from 65μm to 200μm (0.0025” to 0.008”) and is available in sheeting, tubing, V-fold and C-fold versions. Additionally, the film has been proven to be highly UV resistant, absorbing UV radiation at 365 nm up to 100%. Roll lengths and widths vary depending on thickness and application.
In sheet form (LINQSTAT MVCF-S Series), the conductive polyethylene is used as a weak pressure sensor making it useful for applications that have large surface areas and expect large pressure applications. For more sensitive pressure sensor applications, CAPLINQ recommends LINQSTAT XVCF-Series, which is a more-conductive series of polyethylene plastics. As an antistatic packaging plastic, it is also used as a antistatic interleaver for Smartcard (micromodule) applications to separate subsequent layers of smartcard chips in micromodule production.