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LOCTITE 3128 is a one part, heat curable epoxy designed to cure at low temperature and gives excellent adhesion on a wide range of materials in considerably short time. Typical applications include Memory cards, CCD/CMOS Assemblies.
LOCTITE 3128 can be successfully used as an Edgebond underfill, particularly suited where low curing temperatures are required for heat sensitive components.
Recommended cure schedule
Note: Sufficient time must be added to allow the bond location to reach the desired cure temperature. Curing profiles should be developed for each device.