Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
LOCTITE® 3508NH is designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.
LOCTITE® 3508NH is a halogen free reworkable "Cornerbond" underfill that eliminates post reflow dispenses and cure steps while also improving mechanical reliability of handheld devices.
With all curing systems, the time required for cure depends on the rate of heating. Conditions where a hot plate or a heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source. Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results.
Visualization of the cornerbond process for stress relief
LOCTITE® 3508NH application in practice.