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LOCTITE 3508NH

Harmonization Code : 3907.30.00.90 |   Polyacetals, other polyethers and epoxide resins, in primary forms; polycarbonates, alkyd resins, polyallyl esters and other polyesters, in primary forms : Epoxide resins : Other
Main features
  • Reworkable
  • Reflow curable
  • Improves mechanical reliability

Product Description

LOCTITE® 3508NH is designed to cure during Pb-free solder reflow while allowing self-alignment of IC components. It can be pre-applied to the board at the corners of the pad site using a standard SMA dispenser.

LOCTITE® 3508NH is a halogen free reworkable "Cornerbond" underfill that eliminates post reflow dispenses and cure steps while also improving mechanical reliability of handheld devices.

Cure Schedule

  • Pb-free solder reflow profile @ 245°C

  • With all curing systems, the time required for cure depends on the rate of heating. Conditions where a hot plate or a heat sink is used are optimum for fastest cure. Cure rates depend on the mass of material to be heated and intimate contact with the heat source. Use suggested cure conditions as general guidelines. Other cure conditions may yield satisfactory results.

    Product Family
    3508NH  
    30cc Syringe

    Catalog Product

    Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
    Not Available Shipping in 8 - 12 weeks

    Technical Specifications

    General Properties
    Specific Gravity
    Specific Gravity
    Specific gravity (SG) is the ratio of the density of a substance to the density of a reference substance; equivalently, it is the ratio of the mass of a substance to the mass of a reference substance for the same given volume.

    For liquids, the reference substance is almost always water (1), while for gases, it is air (1.18) at room temperature. Specific gravity is unitless.
    1.23
    Mechanical Properties
    Viscosity
    Viscosity
    Viscosity is a measurement of a fluid’s resistance to flow.

    Viscosity is commonly measured in centiPoise (cP). One cP is defined as
    the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

    A product like honey would have a much higher viscosity -around 10,000 cPs-
    compared to water. As a result, honey would flow much slower out of a tipped glass than
    water would.

    The viscosity of a material can be decreased with an increase in temperature in
    order to better suit an application
    Viscosity 70,000 mPa.s
    Storage (DMA) Modulus
    Storage (DMA) Modulus @ 25°C 2,330 N/mm2
    Thermal Properties
    Glass Transition Temperature (Tg)
    Glass Transition Temperature (Tg)
    The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

    The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
    118 °C
    Coefficient of Thermal Expansion (CTE)
    Coefficient of Thermal Expansion (CTE)
    CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

    Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
    system consists of an adhesive plus some other solid component.
    Coefficient of Thermal Expansion (CTE), α1
    Coefficient of Thermal Expansion (CTE), α1
    CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

    It explains how much a material will expand until it reaches Tg.
    65 ppm/°C
    Coefficient of Thermal Expansion (CTE), α2
    Coefficient of Thermal Expansion (CTE), α2
    CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

    It explains the extent to which a material will expand after it passes Tg.
    175 ppm/°C

    Additional Information

    Visualization of the cornerbond process for stress relief


    LOCTITE® 3508NH application in practice.