Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
LOCTITE ABLESTIK 2000 is a hybrid, electrically conductive die attach adhesive, designed for Pb-free PBGA and Array BGA packaging. It exhibits minimal resin bleed, ultra low moisture absorption and high hot/wet adhesion.
LOCTITE ABLESTIK 2000 is a low stress product that is able to withstand the high reflow temperatures necessary for Pb-free solders @ 260°C. It is suitable for die sizes up to 12.7 x 12.7 mm.