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LOCTITE® ABLESTIK 2035SC non-conductive die attach adhesive has been formulated for use in high throughput die attach applications. This material is designed to minimise stress and resulting warpage between dissimilar surfaces.
LOCTITE® ABLESTIK 2035SC is isothermal and based on a proprietary hybrid chemistry that offers low stress and cures fast in relatively low temperatures. This combination makes it ideal for snap cure smart card applications.
LOCTITE ABLESTIK 2035SC is isothermal at 80°C.
The following DSC graph shows 9.9mg on a 40°C/min ramp from 40-80°C with 15min dwell.