Only signed in users will see discount codes and have complete access to product lines, datasheets and pricelists
LOCTITE ABLESTIK 2053S is a polymer filled, hybrid non conductive die attach adhesive with low warpage, high adhesion, low stress and low moisture uptake, designed for use in array packaging. It exhibits great optical performance, complimented by high transmittance, high Optical density and HRI and good adhesion to various interfaces such as EMC, engineering plastic, glass and metals.
LOCTITE ABLESTIK 2053S offers relatively high thermal conductivity with stable optical performance, good temporary bonding and minimal shift and tilt post reliability. It has been successfully used for the ASIC (Application Specific Integrated Circuit) attach of optical sensors, as a receiver Die attach for 3d sensing modules.