Product Description
LOCTITE ABLESTIK 3888 is a two part epoxy paste, designed for bonding of metals, ceramics, rubbers and plastics as used in electronic parts, where good adhesion combined with electrical and thermal conductivity is required. It contains a resin and a hardener and can cure either in room temperature or with heat.
LOCTITE ABLESTIK 3888 has many practical applications which include and are not limited to solder replacement, repair/rework of interconnections, and bonding of heat sensitive components where solder temperatures are impractical. It can withstand operating temperatures up to 80°C.
Cure Schedule:
- 24 hours @ 23 °C
- 2 hours @ 65 °C
- 1 hour @ 125 °C
- 30 minutes @ 150 °C