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LOCTITE® ABLESTIK 8200C is a hybrid, highly electrically conductive die attach adhesive designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
LOCTITE® ABLESTIK 8200C low bleed, silver filled product is suitable, among others for PPF, Copper and silver substrates. This snap curable material has increased reliability on silver plated leadframes.