Product Description
LOCTITE® ABLESTIK 8200C is a hybrid, highly electrically conductive die attach adhesive designed for high reliability package applications with medium thermal and electrical requirements. This material offers improved JEDEC performance on QFN type packages.
LOCTITE® ABLESTIK 8200C low bleed, silver filled product is suitable, among others for PPF, Copper and silver substrates. This snap curable material has increased reliability on silver plated leadframes.
Cure Schedule
- 30 minute ramp to 175°C + 15 minutes @ 175°C