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LOCTITE® ABLESTIK 8387B non conductive die attach adhesive has been formulated for use in high throughput die attach applications. It has an average filler size of
LOCTITE® ABLESTIK 8387B can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC.