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LOCTITE® ABLESTIK 8387B non conductive die attach adhesive has been formulated for use in high throughput die attach applications. It has an average filler size of less than 20um with a maximum of less than 30um and has been used for the glass attach of Optical and 3D sensors. It has been successfully used for lid attach in aerospace and defence applications and should pass the NASA outgassing standards if cured properly.
LOCTITE® ABLESTIK 8387B has good adhesion to glass, is jettable and has minimal adhesion change, post reliability. It can be fast cured using directed heat energy or hot plate curing techniques. In conventional box or convection conveyor oven curing, it will cure at temperatures as low as 100ºC.