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LOCTITE ABLESTIK 8900NCM epoxy die attach adhesive is specially formulated for small to medium size packages. It is a white, heat curable, non conductive adhesive with low resin bleed and low voiding during the cure process. It has moderate stress absorbing capabilities and and can dispense with minimal tailing and stringing. LOCTITE ABLESTIK 8900NCM is PTFE filled and is suitable for bare , Ag plated and Palladium plated copper leadframes. Actual performance will depend on die size, aspect ratio and package design. This product is a green material, containing no CAT3 CMR substances. It is successfully used in Automotive applications as a low modulus, low stress solution on leadframes.