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LOCTITE ABLESTIK ABP 6892

Harmonization Code : 3506.10.00.00 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg

Main features

Designed for Fingerprint Sensors
Low stress for ultra thin glass
Low outgassing and finest filler

Product Description

LOCTITE ABLESTIK ABP 6892 transparent non-conductive die attach BMI/Acrylate is designed to be used for fingerprint sensors. With its low stress and robust mechanical properties the ABP 6892 is targeted for applications that require the bonding of fingerprint sensors in credit cards (such as VISA, Mastercard and American Express), bank cards or other cards that require a secondary authentication process. Due to its low filler size (only a tiny % with max size less than 10um) and low viscosity it is ideal for wire bonding protection. Sensors and devices using the ABP 6892 die bonding material will have a greater resistance to delamination and overall improvement in package reliability.

LOCTITE ABLESTIK ABP 6892 transparent low stress adhesive is ideal for ultra-thin glass or ceramic bonding or sensor dies up to 10x10mm. It has an improved flow for thin bond line (<15um) and excellent workability with a long opening (2 hours) and staging (8 hours) time. This thin bondline enables the better capturing of fingerprints and makes it ideal for optical sensors. This is only made better by the reflow resistant resistant refractive index of 1.50, minimal resin bleed out and low transmittance.

LOCTITE ABLESTIK ABP 6892 has also been used to protect the balls of Au wirebonds around the edge of a chip. ABP6892, when applied by jetting worked well and the low and fast cure time made it suitable for the production process also.

LOCTITE ABLESTIK ABP 6892 can cure below 80°C and provides a robust adhesion and void free bond line post 60°C/90% RH (96hrs) and HTS 120°C (100hrs).

Product Family
ABP6892

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10cc EFD 5cc in 10cc EFD 5cc EFD

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Technical Specifications

General Properties

Curing Schedule

Curing Schedule
Curing schedule is the time and temperature required for a mixed material to fully cure. While this applies to materials that cure with heat, there are also other materials that can be cured with UV.

Even though some materials can cure on ambient temperatures, others will require elevated temperature conditions to properly cure.

There are various curing schedules depending on the material type and application. For heat curing, the most common ones are Snap cure, Low temperature cure, Step cure and Staged cure.

Recommended cure type, schedule, time and temperature can always be found on the Technical data sheets.

Curing

Heat Cure

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C	365 days

Work life @25°C

Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.

24 hours

Mechanical Properties

Die Shear Strength Die Shear Strength Die Shear Strength is the force that has to be applied to the side of the semiconductor die before it shears from its mounting. Shear strength is measured for various die sizes, substrates and operating temperatures so check the Technical data sheet for your intended usage.
3x3mm @25°C	13 kg-f

Tensile Modulus Tensile Modulus Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading. It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed. Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @-65°C	1,912 N/mm2
Tensile Modulus @100°C	28 N/mm2
Tensile Modulus @150°C	24 N/mm2
Tensile Modulus @25°C	176 N/mm2
Tensile Modulus @250°C	37 N/mm2

Viscosity Viscosity Viscosity is a measurement of a fluid’s resistance to flow. Viscosity is commonly measured in centiPoise (cP). One cP is defined as the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP. A product like honey would have a much higher viscosity -around 10,000 cPs- compared to water. As a result, honey would flow much slower out of a tipped glass than water would. The viscosity of a material can be decreased with an increase in temperature in order to better suit an application
Thixotropic index Thixotropic index Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten. A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads. It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.	1.75
Viscosity	4,100 mPa.s

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	111.4 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	190.6 ppm/°C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

-24.6 °C