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LOCTITE ABLESTIK ABP 6892 transparent non-conductive die attach paste that was designed to be used for fingerprint sensors. With its low stress and robust mechanical properties the ABP 6892 is targeted for applications that require the bonding of fingerprint sensors in credit cards (such as VISA, Mastercard and American Express), bank cards or other cards that require a secondary authentication process. Due to its low filler size and low viscosity it is ideal for wire bonding protection. Sensors and devices using the ABP 6892 die bonding material will have a greater resistance to delamination and overall improvement in package reliability.
LOCTITE ABLESTIK ABP 6892 transparent low stress adhesive is ideal for ultra-thin glass or ceramic bonding or sensor dies up to 10x10mm. It has an improved flow for thin bond line (<15um) and excellent workability with a long opening (2 hours) and staging (8 hours) time. This thin bondline enables the better capturing of fingerprints and makes it ideal for optical sensors.
LOCTITE ABLESTIK ABP 6892 can cure below 80°C and provides a robust adhesion and void free bond line post 60°C/90% RH (96hrs) and HTS 120°C (100hrs).
ABP 6892 light transmittance