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LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It boasts one of the highest thermal conductivities among die attach pastes (22 W/mK) only to be beaten by sintering technology.
LOCTITE ABLESTIK ABP 8064T is a 85% filled, soft solder replacement with low outgassing and medium modulus that is stable in High temperatures and can be used for a wide range of packages sizes. Typically it can be applied, among others, to QFP and High power devices.
Recommended Cure Schedule
Alternative Cure Schedule
The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.
It's stated clearly in the TDS that it needs a N2 oven. Is this a prerequisite? Can it be cured in a conventional oven and if so how will this change the cure schedule?
Many customers prefer to cure in Nitrogen, to protect components from oxidation. However, please look at the 8064T data package – slide 33. It states that cure in Air or Nitrogen is OK. Justification data is on slides 30 to 32. It’s rather mathematical, but shows that die shear strength is not significantly affected by the curing atmosphere.
Would this epoxy be suitable to attach a Au plated copper tab to a Ag plated aluminium heatsink?
It is difficult to say. Our recommendation for 5mmx5mm max size is based on Silicon to Cu leadframe. (Expansion Coefficients are very different – 3ppm/C vs. 18ppm/C, so we get a lot of stress from this). However, you are bonding Copper (18 ppm/C) to Aluminium (23 ppm/C), so the expansion mismatch is smaller (about 5ppm/c vs 15ppm/C). So we would say that its worth trying ABP8064T