• x

LOCTITE ABLESTIK ABP 8064T

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
LOCTITE ABLESTIK ABP 8064T
LOCTITE ABLESTIK ABP 8064T
LOCTITE ABLESTIK ABP 8064T
Main features
  • Highest thermal conductivity
  • Soft solder replacement
  • Low outgassing

Product Description

LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It boasts one of the highest thermal conductivities among die attach pastes (22 W/mK) only to be beaten by sintering technology.

LOCTITE ABLESTIK ABP 8064T is a 85% filled, soft solder replacement with low outgassing and medium modulus that is stable in High temperatures and can be used for a wide range of packages sizes. Typically it can be applied, among others, to QFP and High power devices.

Recommended Cure Schedule

  • 60 min ramp from 25°C to 180°C, hold 60 mins at 180°C in N2 oven

Alternative Cure Schedule

  • 60 min ramp from 25°C to 140°C, hold 60 mins at 140°C in N2 oven

The above cure profiles are guideline recommendations. Cure conditions (time and temperature) may vary based on customers' experience and their application requirements, as well as customer curing equipment, oven loading and actual oven temperatures.

Product Family
ABP8064T  
10cc Syringe

Catalog Product

Unlike other products we offer, the products listed on this page cannot currently be ordered directly from the website.
Not Available Shipping in 8 - 12 weeks
Packaging
TDS & SDS
Compare product

Technical Specifications

General Properties
Filler Content 85 %
Work life @25°C
Work life @25°C
Work life is the amount of time we have to work with a material until it is no longer able to be easily worked and applied on a substrate.

It is based on the change in viscosity and it can rely on the application requirements.
 24 hours
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 365 days
Chemical Properties
Extractable Ionic Content, after 20 hours
Chloride (Cl-)
Chloride (Cl-)
The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)
 10 ppm
Sodium (Na+)
Sodium (Na+)
The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)
 10 ppm
Potassium (K+)
Potassium (K+)
The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)
 10 ppm
Mechanical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Viscosity 12,000 mPa.s
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
 5.8
Tensile Modulus
Tensile Modulus
Tensile modulus is a mechanical property that measures the stiffness of an elastic material. It is the slope of stress / strain curve of a material under direct tensile loading.

It can be used to predict the elongation or elastic deformation of an object as long as the stress is less than the tensile strength of the material. Elastic deformation is caused by stretching the bonds between atoms and the deformation can be reversed when the load is removed.

Tensile modulus is affected by temperature and is an important engineering attribute since we generally want to keep elastic deformation as small as possible.
Tensile Modulus @25°C 5,260 N/mm2
Tensile Modulus @250°C 1,280 N/mm2
Die Shear Strength
Die Shear Strength
Die Shear Strength is the force that has to be applied to the side of the semiconductor die before it shears from its mounting.

Shear strength is measured for various die sizes, substrates and operating temperatures so check the Technical data sheet for your intended usage.
2x2mm @25°C 4.6 kg-f 
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 2.0x10-5 Ohms⋅cm
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 44.5 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 22 W/m.K
Coefficient of Thermal Expansion (CTE)
Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1
Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.
 47 ppm/°C
Coefficient of Thermal Expansion (CTE), α2
Coefficient of Thermal Expansion (CTE), α2
CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg).

It explains the extent to which a material will expand after it passes Tg.
 136 ppm/°C

Additional Information

It's stated clearly in the TDS that it needs a N2 oven. Is this a prerequisite? Can it be cured in a conventional oven and if so how will this change the cure schedule?

Many customers prefer to cure in Nitrogen, to protect components from oxidation. However, please look at the 8064T data package – slide 33. It states that cure in Air or Nitrogen is OK. Justification data is on slides 30 to 32. It’s rather mathematical, but shows that die shear strength is not significantly affected by the curing atmosphere.

 

Would this epoxy be suitable to attach a Au plated copper tab to a Ag plated aluminium heatsink?

It is difficult to say. Our recommendation for 5mmx5mm max size is based on Silicon to Cu leadframe. (Expansion Coefficients are very different – 3ppm/C vs. 18ppm/C, so we get a lot of stress from this).  However, you are bonding Copper (18 ppm/C) to Aluminium (23 ppm/C), so the expansion mismatch is smaller (about 5ppm/c vs 15ppm/C). So we would say that its worth trying ABP8064T

High Thermal Conductivity Die Attach Paste