Product Description
LOCTITE ABLESTIK ABP 8064T highly filled, conductive die attach adhesive is designed to provide high thermal and electrical conductivity in the attachment of integrated circuits and components onto metallic leadframes. It boasts one of the highest thermal conductivities among die attach pastes (22 W/mK) only to be beaten by sintering technology.
LOCTITE ABLESTIK ABP 8064T is a 85% filled, soft solder replacement with low outgassing and medium modulus that is stable in High temperatures and can be used for a wide range of packages sizes. Typically it can be applied, among others, to QFP and High power devices.
Cure Schedule
- 60 min ramp from 25°C to 180°C, hold 60 mins at 180°C in N2 oven
- 60 min ramp from 25°C to 140°C, hold 60 mins at 140°C in N2 oven