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LOCTITE ABLESTIK ABP 8142B non-conductive die attach adhesive is designed for MEMs package applications. It has low bleed and a stable modulus in a range between -30 to 200 degrees celcius, resulting in stable stress, making it ideal for pressure sensor applications. Its silicone chemistry should be able to withstand >300°C for a short time if the application requires it.
LOCTITE ABLESTIK ABP 8142B is a flexible, non corrosive silicon based adhesive that is stable in high temperatures. It can potentially withstand reflow temperatures and follow thermal deformations but we advise the customers to test it for their application. It has a relatively low outgassing of 1.42% at 150°C for 60mins.
Please advise the Data package in the Documents section for extensive test results regarding work life, dispensing, bleeding, warpage, adhesion and other properties.