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LOCTITE® ABLESTIK ATB F125E High Modulus non conductive die Attach Film is a 2-in-1 (“precut”) format designed for Small Die applications like DFN, QFN, MLP, SOIC and Sensors moving to thin wafer (<100um). It is formulated for use in wafer lamination processes or as a preform decal.
LOCTITE® ABLESTIK ATB F125E adhesive film has a thickness of 25um but it is also available in 50 and 75um. The single layer 25um die attach film on special UV dicing tape is suitable for die size range from 0.3x0.3mm to 3x3mm. It performs excellently for die pickup without die fly and re-attach down to 0.3mm die size and for fast die placement (30-100ms) up to 9 months after lamination. Additionally it passes MSL1 up to 2x2mm die.
ATB F125E Additional properties