LOCTITE ABLESTIK CE8500

Harmonization Code : 3506.91.90.99 | Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other

Main features

Flexible
Low stress
Bond mismatched substrates

Product Description

LOCTITE® ABLESTIK CE 8500 is a solventless epoxy adhesive that combines low stress with good adhesion on nearly all surfaces. This silver filled, electrically conductive, modified, epoxy offers low stress and can be used to bond mismatched adherents due to its flexibility.

LOCTITE® ABLESTIK CE 8500 can operate in temperatures ranging from -45°C to 200°C and due to its thermal conductivity is typically used for substrate attach, heat sink attach and sensor attach.

Cure Schedule

90 minutes @ 120°C or
40 minutes @ 150°C or
15 minutes @ 175°C

Specifications

Technical Specifications

Physical Properties

Viscosity

Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application

120,000 mPa.s

Chemical Properties

Ionic Content
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	150 ppm
Potassium (K+) Potassium (K+) The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)	10 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	10 ppm

Moisture absorption

1.5 %

Mechanical Properties

Elongation

Elongation
Elongation is the process of lengthening something.

It is a percentage that measures the initial, unstressed, length compared to the length of the material right before it breaks.

It is commonly referred to as Ultimate Elongation or Tensile Elongation at break.

10 %

Electrical Properties

Volume Resistivity

Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.

2.0x10^-4 Ohms⋅cm

Thermal Properties

Coefficient of Thermal Expansion (CTE)

Coefficient of Thermal Expansion (CTE)
CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material.

Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a
system consists of an adhesive plus some other solid component.

Coefficient of Thermal Expansion (CTE), α1

Coefficient of Thermal Expansion (CTE), α1
CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg).

It explains how much a material will expand until it reaches Tg.

55 ppm/°C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

24 °C

Thermal Conductivity

Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.

4 W/m.K