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LOCTITE ABLESTIK CF 3350 epoxy assembly film adhesive is formulated for electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance. It is typically used to bond circuit board materials, metal backplanes and heatsinks and can be applied on fluoropolymer, ceramic, copper, brass, kovar and aluminum substrates.
LOCTITE ABLESTIK CF 3350 is a gray, flexible, thermally and electrically conductive film that provides electrical continuity and minimum thermal resistance to the heatsink . It meets the NASA outgassing standards and the requirements of MIL-STD-883, Method 5011 for adhesives.