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LOCTITE ABLESTIK ICP 3535M2 electrically conductive adhesive is designed for circuit assembly applications. It is specifically recommended for mounting lower cost tin (Sn) finished components onto the conductive trace terminations of printed circuit boards or co-fired ceramic circuitry. From a chemistry standpoint it is the best option for Sn and Ni non noble metal alloys.
LOCTITE ABLESTIK ICP 3535M2 is designed for applications with small size components (0603, 0402) where no bleeding or wicking (absorbing liquid by capillary action) is tolerated. This adhesive can be applied by stencil printing. It can also be dispensed but due to its viscosity it might require some optimization.
Recommended Cure Schedule:
This is a Recommended schedule but it can vary per application.