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LOCTITE ABLESTIK ICP 3535M2

Harmonization Code : 3506.91.90.99 |   Prepared glues and other prepared adhesives, not elsewhere specified or included; products suitable for use as glues or adhesives, put up for retail sale as glues or adhesives, not exceeding a net weight of 1 kg ; Adhesives based on polymers of headings 3901 to 3913 or on rubber; Other ; Other
LOCTITE ABLESTIK ICP 3535M2
LOCTITE ABLESTIK ICP 3535M2
LOCTITE ABLESTIK ICP 3535M2
Main features
  • Adhesion stability
  • Pb free alternative to solder
  • Excellent for Sn terminated components

Product Description

LOCTITE ABLESTIK ICP 3535M2 electrically conductive adhesive is designed for circuit assembly applications. It is specifically recommended for mounting lower cost tin (Sn) finished components onto the conductive trace terminations of printed circuit boards or co-fired ceramic circuitry. From a chemistry standpoint it is the best option for Sn and Ni non noble metal alloys.

LOCTITE ABLESTIK ICP 3535M2 is designed for applications with small size components (0603, 0402) where no bleeding or wicking (absorbing liquid by capillary action) is tolerated. This adhesive can be applied by stencil printing. It can also be dispensed but due to its viscosity it might require some optimization.

 

Recommended Cure Schedule:

  • 1 hour @ 150°C or
  • 10 minutes @ 175°C 

This is a Recommended schedule but it can vary per application. 

Product Family
ICP3535M2  
10cc Syringe

Catalog Product

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Packaging
TDS & SDS
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Technical Specifications

General Properties
Density
Density
Volumetric mass per unit
 4.0 kg/m3
Shelf Life
Shelf Life
Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties.

It differs vastly per product and it is based on temperature and storage conditions.

The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ -40°C 183 days
Mechanical Properties
Viscosity
Viscosity
Viscosity is a measurement of a fluid’s resistance to flow.

Viscosity is commonly measured in centiPoise (cP). One cP is defined as
the viscosity of water and all other viscosities are derived from this base. MPa is another common unit with a 1:1 conversion to cP.

A product like honey would have a much higher viscosity -around 10,000 cPs-
compared to water. As a result, honey would flow much slower out of a tipped glass than
water would.

The viscosity of a material can be decreased with an increase in temperature in
order to better suit an application
Viscosity 80,000 mPa.s
Thixotropic index
Thixotropic index
Thixotropic Index is a ratio of a material s viscosity at two different speeds in Ambient temperature, generally different by a factor of ten.

A thixotropic material s viscosity will decrease as agitation or pressure is increased. It indicates the capability of a material to hold its shape. Mayonnaise is a great example of this. It holds its shape very well, but when a shear stress is applied, the material easily spreads.

It helps in choosing a material in accordance to the application, dispense method and viscosity of a material.
 4.0
Electrical Properties
Volume Resistivity
Volume Resistivity
Volume resistivity, also called volume resistance, bulk resistance or bulk resistivity is a thickness dependent measurement of the resistivity of a material perpendicular to the plane of the surface.
 2.0x10-4 Ohms⋅cm
Thermal Properties
Glass Transition Temperature (Tg)
Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.
 96 °C
Thermal Conductivity
Thermal Conductivity
Thermal conductivity describes the ability of a material to conduct heat. It is required by power packages in order to dissipate heat and maintain stable electrical performance.

Thermal conductivity units are [W/(m K)] in the SI system and [Btu/(hr ft °F)] in the Imperial system.
 2.2 W/m.K