Product Description
LOCTITE® ABLESTIK ICP 4001 Ag filled, silicone-based, one component, electrically conductive adhesive is recommended for use in attaching devices or mount components in circuit assembly applications. It is specifically designed to provide reliable low stress interconnects exposed to prolonged vibrational energy and high operating temperatures.
LOCTITE® ABLESTIK ICP 4001 has been optimised to maintain its flexibility and survive at operating temperatures as high as 200ºC. it has low outgassing and low bleeding during cure
LOCTITE® ABLESTIK ICP 4001 common applications include and are not limited to:
- Bonding of noble passive components onto noble terminated lead frames for electronic sensors
- Back contact bonding of c-Si PV cells to conductive Ag tracks
Cure Schedule