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LOCTITE ABLESTIK NCF 218

Harmonization Code : 3920.99.28.90 | Other plates, sheets, film, foil and strip, of plastics, non-cellular and not reinforced, laminated, supported or similarly combined with other materials ; Of other plastics ; Other; Other

Main features

Non conductive Underfill film
Enables fine pitch, narrow gap Cu pillar
TSV, Die to die & Die to substrate

Product Description

LOCTITE ABLESTIK NCF 218 Non conductive Underfill film is specially formulated for Pb free, low κ, thin gap, large and thin die that are being used in advance flip chip applications. It is an ideal material for 3d die stacking in memory devices.

LOCTITE ABLESTIK NCF 218 is mainly used for Flip chips with bumps and pillars. Its main function is to fully encapsulate the tiny and fragile bumps/pillar interconnects and reinforce and destress the joints during temperature cycling tests. Additionally, it contains a fluxing agent that improves the interconnections between the bumps and the substrate.

LOCTITE ABLESTIK NCF 218 is suitable for die to die, die to wafer (TSV) or die to substrate applications. It is a 2 in 1, BMI based, heat curable yellow film that is typically used for Thermal compression bonding. The standard NCF 218 film has 18um layer thickness but it can also service thicknesses ranging from 15 to 40um.

Cure Schedule

30 minutes ramp to 175ºC, hold 2 hours @ 175°C

Specifications

Technical Specifications

General Properties

Shelf Life Shelf Life Shelf life is the amount of time after manufacturing that a product is guaranteed to retain its properties. It differs vastly per product and it is based on temperature and storage conditions. The properties can be guaranteed for the temperature and time range indicated on the TDS since those are the ones tested to be the best for the product.
Shelf Life @ 5°C	183 days

Chemical Properties

Extractable Ionic Content, after 20 hours
Chloride (Cl-) Chloride (Cl-) The amount of Chloride (Cl-) ion extracted from the product in parts per million (ppm)	10 ppm
Potassium (K+) Potassium (K+) The amount of Potassium (K+) ion extracted from the product in parts per million (ppm)	10 ppm
Sodium (Na+) Sodium (Na+) The amount of Sodium (Na+) ion extracted from the product in parts per million (ppm)	10 ppm

Mechanical Properties

Die Shear Strength Die Shear Strength Die Shear Strength is the force that has to be applied to the side of the semiconductor die before it shears from its mounting. Shear strength is measured for various die sizes, substrates and operating temperatures so check the Technical data sheet for your intended usage.
3x3mm @260°C	54 kg-f

Storage (DMA) Modulus
Storage (DMA) Modulus @ 25°C	6400 N/mm2
Storage (DMA) Modulus @ 260°C	110 N/mm2

Thermal Properties

Coefficient of Thermal Expansion (CTE) Coefficient of Thermal Expansion (CTE) CTE (Coefficient of thermal expansion) is a material property that is indicative of the extent to which a material expands with a change in temperature. This can be a change in length, area or volume, depending on the material. Knowing the CTE of the layers is helpful in analyzing stresses that might occur when a system consists of an adhesive plus some other solid component.
Coefficient of Thermal Expansion (CTE), α1 Coefficient of Thermal Expansion (CTE), α1 CTE α1 (alpha 1) is the slope of the Coefficient of thermal expansion in a temperature range below the Glass transition temperature (Tg). It explains how much a material will expand until it reaches Tg.	24 ppm/°C
Coefficient of Thermal Expansion (CTE), α2 Coefficient of Thermal Expansion (CTE), α2 CTE α2 (alpha 2) is the slope of the Coefficient of thermal expansion in a temperature range above the Glass transition temperature (Tg). It explains the extent to which a material will expand after it passes Tg.	190 ppm/°C

Glass Transition Temperature (Tg)

Glass Transition Temperature (Tg)
The glass transition temperature for organic adhesives is a temperature region where the polymers change from glassy and brittle to soft and rubbery. Increasing the temperature further continues the softening process as the viscosity drops too. Temperatures between the glass transition temperature and below the decomposition point of the adhesive are the best region for bonding.

The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs.

119 °C